{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T02:04:19Z","timestamp":1740103459473,"version":"3.37.3"},"reference-count":22,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,8,18]],"date-time":"2024-08-18T00:00:00Z","timestamp":1723939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,8,18]],"date-time":"2024-08-18T00:00:00Z","timestamp":1723939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52278424"],"award-info":[{"award-number":["52278424"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,8,18]]},"DOI":"10.1109\/indin58382.2024.10774502","type":"proceedings-article","created":{"date-parts":[[2024,12,12]],"date-time":"2024-12-12T19:05:07Z","timestamp":1734030307000},"page":"1-7","source":"Crossref","is-referenced-by-count":0,"title":["Assessing the Impact of Pavement Material as Transmission Medium on the Interoperability of Magnetic Couplers for Inductive Electric Vehicle Charging"],"prefix":"10.1109","author":[{"given":"Yanjie","family":"Li","sequence":"first","affiliation":[{"name":"School of Transportation Science and Engineering, Beihang University,Beijing,China"}]},{"given":"Siqi","family":"Zhou","sequence":"additional","affiliation":[{"name":"School of Transportation Science and Engineering, Beihang University,Beijing,China"}]},{"given":"Feng","family":"Li","sequence":"additional","affiliation":[{"name":"School of Transportation Science and Engineering, Beihang University,Beijing,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2022.118877"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.renene.2020.03.012"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.renene.2020.07.013"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.jclepro.2020.121703"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-023-00933-z"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/1742-6596\/842\/1\/012037"},{"key":"ref7","article-title":"Towards new infrastructure materials for on-the-road charging A study of potential materials, construction and maintenance","author":"Chen","year":"2014","journal-title":"IEEE IEVC, Florence"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2179274"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2011.6064008"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/PEAC.2018.8590529"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/s00202-022-01607-3"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/INDICON49873.2020.9342265"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2433678"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2016.2600162"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2606893"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2013.2264473"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.3390\/en16041653"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TITS.2021.3099490"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ITEC.2013.6574506"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2023.3286412"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2022.119631"},{"volume-title":"Standard test methods for permeability of weakly magnetic materials","year":"2014","key":"ref22"}],"event":{"name":"2024 IEEE 22nd International Conference on Industrial Informatics (INDIN)","start":{"date-parts":[[2024,8,18]]},"location":"Beijing, China","end":{"date-parts":[[2024,8,20]]}},"container-title":["2024 IEEE 22nd International Conference on Industrial Informatics (INDIN)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10774078\/10774079\/10774502.pdf?arnumber=10774502","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,15]],"date-time":"2025-01-15T19:25:37Z","timestamp":1736969137000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10774502\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8,18]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/indin58382.2024.10774502","relation":{},"subject":[],"published":{"date-parts":[[2024,8,18]]}}}