{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,7]],"date-time":"2026-01-07T19:31:51Z","timestamp":1767814311624,"version":"3.49.0"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,7,12]],"date-time":"2025-07-12T00:00:00Z","timestamp":1752278400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,12]],"date-time":"2025-07-12T00:00:00Z","timestamp":1752278400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100018537","name":"National Science and Technology Major Project","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100018537","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,7,12]]},"DOI":"10.1109\/indin64977.2025.11279056","type":"proceedings-article","created":{"date-parts":[[2026,1,6]],"date-time":"2026-01-06T18:33:35Z","timestamp":1767724415000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Deep Learning for Assembly Deviation Estimation: A UNet-based Contact Point Prediction Approach Using Mating Status Image"],"prefix":"10.1109","author":[{"given":"Jiarui","family":"Wang","sequence":"first","affiliation":[{"name":"Huazhong University of Science and Technology,School of Mechanical Science & Engineering,Wuhan,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Junfeng","family":"Wang","sequence":"additional","affiliation":[{"name":"Huazhong University of Science and Technology,School of Mechanical Science & Engineering,Wuhan,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yixin","family":"Dong","sequence":"additional","affiliation":[{"name":"Huazhong University of Science and Technology,School of Mechanical Science & Engineering,Wuhan,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yang","family":"Mao","sequence":"additional","affiliation":[{"name":"Huazhong University of Science and Technology,School of Mechanical Science & Engineering,Wuhan,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zijian","family":"Wang","sequence":"additional","affiliation":[{"name":"Huazhong University of Science and Technology,School of Mechanical Science & Engineering,Wuhan,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/icma57826.2023.10216112"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1115\/1.1573235"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/s0010-4485(03)00156-8"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1631\/jzus.a1400239"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.cad.2014.01.001"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-022-09628-9"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.cad.2015.03.004"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.precisioneng.2018.07.005"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.cad.2019.06.001"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1177\/0954405420958862"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/iccv.2019.00010"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1117\/1.ap.1.2.025001"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2024.08.011"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.aei.2024.102871"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.cad.2018.05.005"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.isprsjprs.2020.01.013"}],"event":{"name":"2025 IEEE 23rd International Conference on Industrial Informatics (INDIN)","location":"Kunming, China","start":{"date-parts":[[2025,7,12]]},"end":{"date-parts":[[2025,7,15]]}},"container-title":["2025 IEEE 23rd International Conference on Industrial Informatics (INDIN)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11278897\/11278845\/11279056.pdf?arnumber=11279056","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,1,7]],"date-time":"2026-01-07T18:30:39Z","timestamp":1767810639000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11279056\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7,12]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/indin64977.2025.11279056","relation":{},"subject":[],"published":{"date-parts":[[2025,7,12]]}}}