{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T06:23:15Z","timestamp":1730269395732,"version":"3.28.0"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,7]]},"DOI":"10.1109\/iolts.2019.8854437","type":"proceedings-article","created":{"date-parts":[[2019,10,3]],"date-time":"2019-10-03T20:27:48Z","timestamp":1570134468000},"page":"60-63","source":"Crossref","is-referenced-by-count":2,"title":["Methodology for Tradeoffs between Performance and Lifetimes of Integrated Circuits"],"prefix":"10.1109","author":[{"given":"Daniel","family":"Weyer","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Francis","family":"Wolff","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chris","family":"Papachristou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Steve","family":"Clay","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"crossref","first-page":"1023","DOI":"10.1109\/PROC.1971.8315","article-title":"concerning electromigration in thin films","volume":"59","author":"blair","year":"1971","journal-title":"Proceedings of the IEEE"},{"journal-title":"JEDEC Solid state Technology Association","article-title":"Standard method for calculating the electromigration model parameters for current density and temperature","year":"1998","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1999.782207"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1998.724536"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1063\/1.2655531"},{"journal-title":"Amber arm-compatible core Overview","year":"2017","key":"ref15"},{"key":"ref4","article-title":"Electromigration for designers: An introduction for the non-specialist","author":"lloyd","year":"2002","journal-title":"TechOnLine"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"75","DOI":"10.1109\/6.535398","article-title":"Electromigration: the time bomb in deep-submicron ics","volume":"33","author":"li","year":"1996","journal-title":"IEEE Spectrum"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/0034-4885\/52\/3\/002"},{"journal-title":"Electromigration – what ic designers need to know","year":"2014","author":"goering","key":"ref5"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/0022-3697(61)90138-X"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-00122-7_6"},{"journal-title":"Semiconductors Integrated Circuit Design for Manufacturability","year":"2016","author":"balasinski","key":"ref2"},{"key":"ref1","first-page":"114","article-title":"Moore’s law","volume":"38","author":"moore","year":"1965","journal-title":"Electronics Magazine"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"148","DOI":"10.1109\/IRPS.1967.362408","article-title":"Mass transport of aluminum by momentum exchange with conducting electrons","author":"black","year":"1967","journal-title":"6th Annual Reliability Physics Symposium (IEEE)"}],"event":{"name":"2019 IEEE 25th International Symposium on On-Line Testing And Robust System Design (IOLTS)","start":{"date-parts":[[2019,7,1]]},"location":"Rhodes, Greece","end":{"date-parts":[[2019,7,3]]}},"container-title":["2019 IEEE 25th International Symposium on On-Line Testing and Robust System Design (IOLTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8846168\/8854369\/08854437.pdf?arnumber=8854437","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T17:51:35Z","timestamp":1658080295000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8854437\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,7]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/iolts.2019.8854437","relation":{},"subject":[],"published":{"date-parts":[[2019,7]]}}}