{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,24]],"date-time":"2025-10-24T08:28:40Z","timestamp":1761294520867},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,9,12]],"date-time":"2022-09-12T00:00:00Z","timestamp":1662940800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,9,12]],"date-time":"2022-09-12T00:00:00Z","timestamp":1662940800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,9,12]]},"DOI":"10.1109\/iolts56730.2022.9897814","type":"proceedings-article","created":{"date-parts":[[2022,9,27]],"date-time":"2022-09-27T19:57:10Z","timestamp":1664308630000},"page":"1-5","source":"Crossref","is-referenced-by-count":4,"title":["Radiation Hardened Flip-Flops Minimizing Area, Power, and Delay Overheads with 1\/100 Lower \u03b1-SER in a 130 nm Bulk Process"],"prefix":"10.1109","author":[{"given":"Ryuichi","family":"Nakajima","sequence":"first","affiliation":[{"name":"Kyoto Institute of Technology,Dept. of Electronics,Kyoto,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kazuya","family":"Ioki","sequence":"additional","affiliation":[{"name":"ROHM Co., Ltd,Kyoto,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Furuta","sequence":"additional","affiliation":[{"name":"Kyoto Institute of Technology,Dept. of Electronics,Kyoto,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kazutoshi","family":"Kobayashi","sequence":"additional","affiliation":[{"name":"Kyoto Institute of Technology,Dept. of Electronics,Kyoto,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2021.3075176"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/23.556880"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/23.903813"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2014.2359472"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DSN.2002.1028924"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2002.996639"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2002.1175845"}],"event":{"name":"2022 IEEE 28th International Symposium on On-Line Testing and Robust System Design (IOLTS)","start":{"date-parts":[[2022,9,12]]},"location":"Torino, Italy","end":{"date-parts":[[2022,9,14]]}},"container-title":["2022 IEEE 28th International Symposium on On-Line Testing and Robust System Design (IOLTS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9897157\/9897171\/09897814.pdf?arnumber=9897814","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,10,14]],"date-time":"2022-10-14T20:54:35Z","timestamp":1665780875000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9897814\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,12]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/iolts56730.2022.9897814","relation":{},"subject":[],"published":{"date-parts":[[2022,9,12]]}}}