{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,28]],"date-time":"2025-10-28T17:52:16Z","timestamp":1761673936504,"version":"build-2065373602"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/ipccc47392.2019.8958735","type":"proceedings-article","created":{"date-parts":[[2020,1,16]],"date-time":"2020-01-16T21:04:32Z","timestamp":1579208672000},"page":"1-2","source":"Crossref","is-referenced-by-count":3,"title":["High-Precision Adaptive Slope Compensation Circuit for System-on-Chip Power Management"],"prefix":"10.1109","author":[{"given":"Hua","family":"Fan","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China"}]},{"given":"Weiping","family":"Cheng","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China"}]},{"given":"Yang","family":"Li","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering,Chengdu,China"}]},{"given":"Quanyuan","family":"Feng","sequence":"additional","affiliation":[{"name":"Southwest Jiaotong University,The school of information science and technology,Chengdu,China"}]},{"given":"Hongrui","family":"Che","sequence":"additional","affiliation":[{"name":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China"}]},{"given":"Xuanhong","family":"Zeng","sequence":"additional","affiliation":[{"name":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China"}]},{"given":"Haizhu","family":"Wang","sequence":"additional","affiliation":[{"name":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China"}]},{"given":"Hongquan","family":"Wang","sequence":"additional","affiliation":[{"name":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China"}]},{"given":"Dagang","family":"Li","sequence":"additional","affiliation":[{"name":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China"}]},{"given":"Kelin","family":"Zhang","sequence":"additional","affiliation":[{"name":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China"}]},{"given":"Yuanjun","family":"Cen","sequence":"additional","affiliation":[{"name":"Chengdu Sino Microelectronics Technology Co.,Ltd,Chengdu,China"}]},{"given":"Kaung Oo","family":"Htet","sequence":"additional","affiliation":[{"name":"University of Glasgow,Electronics and Nanoscale Engineering Division, School of Engineering,Glasgow,UK,G12 8QQ"}]},{"given":"Hadi","family":"Heidari","sequence":"additional","affiliation":[{"name":"University of Glasgow,Electronics and Nanoscale Engineering Division, School of Engineering,Glasgow,UK,G12 8QQ"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2009.2022297"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2700483"},{"key":"ref6","first-page":"1306","article-title":"Design of slope compensation for a high-efficiency high-current dc-dc converter","author":"hu","year":"2016","journal-title":"2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IGARSS.2008.4779244"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2014.6803345"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECCE.2014.6953865"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JCAI.2009.120"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2691048"}],"event":{"name":"2019 IEEE 38th International Performance Computing and Communications Conference (IPCCC)","start":{"date-parts":[[2019,10,29]]},"location":"London, UK","end":{"date-parts":[[2019,10,31]]}},"container-title":["2019 IEEE 38th International Performance Computing and Communications Conference (IPCCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8955479\/8958711\/08958735.pdf?arnumber=8958735","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,28]],"date-time":"2025-10-28T17:32:25Z","timestamp":1761672745000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8958735\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/ipccc47392.2019.8958735","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}