{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T00:34:07Z","timestamp":1729643647550,"version":"3.28.0"},"reference-count":27,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/irps.2015.7112682","type":"proceedings-article","created":{"date-parts":[[2015,6,3]],"date-time":"2015-06-03T15:32:57Z","timestamp":1433345577000},"page":"2D.3.1-2D.3.6","source":"Crossref","is-referenced-by-count":4,"title":["An evaluation of accelerated failure time models of stress-migration and stress-induced voiding failures under vias"],"prefix":"10.1109","author":[{"given":"Gavin D.R.","family":"Hall","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Derryl D.J.","family":"Allman","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.2436833"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1063\/1.2061896"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1557\/JMR.1997.0279"},{"journal-title":"Fracture at High Temperatures","year":"1986","author":"riedel","key":"ref13"},{"journal-title":"Statistical Methods for Reliability Data","year":"1998","author":"meeker","key":"ref14"},{"key":"ref15","doi-asserted-by":"crossref","first-page":"73504","DOI":"10.1063\/1.3644972","article-title":"Stress migration model for Cu interconnect reliability analysis","volume":"110","author":"yao","year":"2011","journal-title":"J Appl Phys"},{"journal-title":"Thin Film Materials","year":"2003","author":"freund","key":"ref16"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2012.6241897"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1063\/1.1904721"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1146\/annurev.matsci.26.1.333"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2008.4558918"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-0348-0009-9"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2013.2237775"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/16.202791"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.347457"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1147\/rd.394.0465"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1063\/1.354480"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1116\/1.583609"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/0036-9748(89)90053-7"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6860581"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1063\/1.347222"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1063\/1.349852"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"ref24","first-page":"1","article-title":"Constrained grain boundary diffusion in thin copper films","author":"buehler","year":"2005","journal-title":"Handbook of Theoretical and Computational Nanotechnology"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1002\/0471749311"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-33483-2"},{"journal-title":"Statistical Analysis of Extreme Values","year":"2007","author":"reiss","key":"ref25"}],"event":{"name":"2015 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2015,4,19]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2015,4,23]]}},"container-title":["2015 IEEE International Reliability Physics Symposium"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7106273\/7112653\/07112682.pdf?arnumber=7112682","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T08:55:05Z","timestamp":1498208105000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7112682\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/irps.2015.7112682","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}