{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T06:52:25Z","timestamp":1730271145507,"version":"3.28.0"},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/irps.2015.7112750","type":"proceedings-article","created":{"date-parts":[[2015,6,3]],"date-time":"2015-06-03T15:32:57Z","timestamp":1433345577000},"page":"5C.2.1-5C.2.5","source":"Crossref","is-referenced-by-count":3,"title":["The electromigration behavior of copper pillars for different current directions and pillar shapes"],"prefix":"10.1109","author":[{"given":"Christine","family":"Hau-Riege","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"You Wen","family":"Yau","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kevin","family":"Caffey","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rajneesh","family":"Kumar","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"YangYang","family":"Sun","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andy","family":"Bao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Milind","family":"Shah","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lily","family":"Zhao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Omar","family":"Bchir","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ahmer","family":"Syed","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Steve","family":"Bezuk","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Rel Phys Symp","year":"2011","author":"hau-riege","key":"ref4"},{"journal-title":"Elec Comp Tech Conf","year":"2011","author":"syed","key":"ref3"},{"journal-title":"Proc 41st Int Reliability Physics Symp","year":"2003","author":"hau-riege","key":"ref10"},{"journal-title":"Int'l Micro Assembly and Packag Soc","year":"2012","author":"syed","key":"ref6"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1063\/1.336731"},{"journal-title":"Comp and Tech Conf","year":"2011","author":"labie","key":"ref5"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"journal-title":"Elec Comp Tech Conf","year":"2006","author":"pendse","key":"ref7"},{"journal-title":"Elec Comp Tech Conf","year":"2014","author":"hau-riege","key":"ref2"},{"key":"ref9","volume":"78","author":"wang","year":"2001","journal-title":"Appl Phys Lett"},{"journal-title":"Rel Phys Symp","year":"2011","author":"frank","key":"ref1"}],"event":{"name":"2015 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2015,4,19]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2015,4,23]]}},"container-title":["2015 IEEE International Reliability Physics Symposium"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7106273\/7112653\/07112750.pdf?arnumber=7112750","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T15:29:13Z","timestamp":1490369353000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7112750\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/irps.2015.7112750","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}