{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T23:57:21Z","timestamp":1729641441903,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/irps.2015.7112762","type":"proceedings-article","created":{"date-parts":[[2015,6,3]],"date-time":"2015-06-03T15:32:57Z","timestamp":1433345577000},"page":"6B.2.1-6B.2.5","source":"Crossref","is-referenced-by-count":3,"title":["Product-level reliability estimator with budget-based reliability management in 20nm technology"],"prefix":"10.1109","author":[{"given":"Jae-Gyung","family":"Ahn","sequence":"first","affiliation":[]},{"given":"Ming Feng","family":"Lu","sequence":"additional","affiliation":[]},{"given":"Nitin","family":"Navale","sequence":"additional","affiliation":[]},{"given":"Dawn","family":"Graves","sequence":"additional","affiliation":[]},{"given":"Ping-Chin","family":"Yeh","sequence":"additional","affiliation":[]},{"given":"Jonathan","family":"Chang","sequence":"additional","affiliation":[]},{"given":"S. Y.","family":"Pai","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"86","DOI":"10.1109\/TDMR.2010.2093526","article-title":"Statistical Evalulation of Electromigration Reliability at Chip Level","volume":"11","author":"baozhen","year":"2011","journal-title":"IEEE Transactions on Device and Materials Reliability"},{"key":"ref3","first-page":"pr.1.1","article-title":"Product-Level Reliability Estimator with Advanced CMOS Technology","author":"ahn","year":"2013","journal-title":"Proceeding of IRPS"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6860610"},{"key":"ref5","first-page":"6b.1.1","article-title":"Practical Implications of Chip-Level Statistical Electromigraion","author":"schmitz","year":"2012","journal-title":"Proceeding of IRPS"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6860649"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2009.5173255"}],"event":{"name":"2015 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2015,4,19]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2015,4,23]]}},"container-title":["2015 IEEE International Reliability Physics Symposium"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7106273\/7112653\/07112762.pdf?arnumber=7112762","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T08:55:04Z","timestamp":1498208104000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7112762\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/irps.2015.7112762","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}