{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,4]],"date-time":"2025-07-04T13:25:51Z","timestamp":1751635551240},"reference-count":16,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/irps.2015.7112766","type":"proceedings-article","created":{"date-parts":[[2015,6,3]],"date-time":"2015-06-03T19:32:57Z","timestamp":1433359977000},"page":"6C.1.1-6C.1.6","source":"Crossref","is-referenced-by-count":27,"title":["Commercialization and reliability of 600 V GaN power switches"],"prefix":"10.1109","author":[{"given":"Toshihide","family":"Kikkawa","sequence":"first","affiliation":[]},{"given":"Tsutomu","family":"Hosoda","sequence":"additional","affiliation":[]},{"given":"Ken","family":"Shono","sequence":"additional","affiliation":[]},{"given":"Kenji","family":"Imanishi","sequence":"additional","affiliation":[]},{"given":"Yoshimori","family":"Asai","sequence":"additional","affiliation":[]},{"given":"YiFeng","family":"Wu","sequence":"additional","affiliation":[]},{"given":"Likun","family":"Shen","sequence":"additional","affiliation":[]},{"given":"Kurt","family":"Smith","sequence":"additional","affiliation":[]},{"given":"Dixie","family":"Dunn","sequence":"additional","affiliation":[]},{"given":"Saurabh","family":"Chowdhury","sequence":"additional","affiliation":[]},{"given":"Peter","family":"Smith","sequence":"additional","affiliation":[]},{"given":"John","family":"Gritters","sequence":"additional","affiliation":[]},{"given":"Lee","family":"McCarthy","sequence":"additional","affiliation":[]},{"given":"Ronald","family":"Barr","sequence":"additional","affiliation":[]},{"given":"Rakesh","family":"Lal","sequence":"additional","affiliation":[]},{"given":"Umesh","family":"Mishra","sequence":"additional","affiliation":[]},{"given":"Primit","family":"Parikh","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"year":"0","key":"ref10","article-title":"Stress Test Qualification for Automotive Grade Discrete Semiconductors"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA.2013.6695551"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2284248"},{"key":"ref13","first-page":"3s","article-title":"High Field Reliability of GaN Power Devices","author":"smith","year":"2014","journal-title":"Reliability of Compound Semiconductors Workshop"},{"key":"ref14","article-title":"Commercialization of 600V GaN HEMTs","author":"parikh","year":"2014","journal-title":"2014 SSDM Tsukuba"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046968"},{"journal-title":"Press release Yaskawa Electric Corp","year":"2014","key":"ref16"},{"journal-title":"JEDEC JESD22-A110D","article-title":"Highly Accelerated Temperature and Humidity Stress Test","year":"0","key":"ref4"},{"journal-title":"JEDEC JESD22-A108D","article-title":"Temperature, Bias, and Operating Life","year":"0","key":"ref3"},{"journal-title":"JEDEC JESD22-A102D","article-title":"Accelerated Moisture Resistance - Unbiased Autoclave","year":"0","key":"ref6"},{"journal-title":"JEDEC JESD22-A104D","article-title":"Temperature Cycling","year":"0","key":"ref5"},{"journal-title":"IPC\/JEDEC J-STD-020D","article-title":"Moisture\/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices","year":"0","key":"ref8"},{"journal-title":"JEDEC JESD22-A122","article-title":"Power Cycling","year":"0","key":"ref7"},{"journal-title":"JEDEC JESD22-A103D","article-title":"High Temperature Storage Life","year":"0","key":"ref2"},{"journal-title":"JEDEC JESD47I Stress-Test-Driven Qualification of Integrated Circuit","year":"0","key":"ref1"},{"journal-title":"IPC\/JEDEC J-STD-033C","article-title":"Handling, Packing, Shipping and Use of Moisture\/Reflow Sensitive Surface Mount Devices","year":"0","key":"ref9"}],"event":{"name":"2015 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2015,4,19]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2015,4,23]]}},"container-title":["2015 IEEE International Reliability Physics Symposium"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7106273\/7112653\/07112766.pdf?arnumber=7112766","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T19:23:28Z","timestamp":1490383408000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7112766\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/irps.2015.7112766","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}