{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T13:51:19Z","timestamp":1725457879255},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/irps.2015.7112775","type":"proceedings-article","created":{"date-parts":[[2015,6,3]],"date-time":"2015-06-03T19:32:57Z","timestamp":1433359977000},"page":"BD.3.1-BD.3.4","source":"Crossref","is-referenced-by-count":0,"title":["Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node"],"prefix":"10.1109","author":[{"given":"Li Chieh","family":"Hsu","sequence":"first","affiliation":[]},{"given":"Yu Min","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Chien Liang","family":"Wu","sequence":"additional","affiliation":[]},{"given":"Wei Kun","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Yen Chun","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Cheng Pu","family":"Chiu","sequence":"additional","affiliation":[]},{"given":"Hsin Kuo","family":"Hsu","sequence":"additional","affiliation":[]},{"given":"Chun Yi","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Chien Chung","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Chin Fu","family":"Lin","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"3","article-title":"Effect of Chemical Machanical Polish Scarcth on TDDB Reliability and its Reduction in 45nm BEOL Process","author":"liu","year":"0","journal-title":"IRPS(2012)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2011.5784470"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1149\/2.033111jes"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6532056"},{"key":"ref2","article-title":"Effects of Cu surface roughness on TDDB for direct polishing ultra low k dielectric Cu interconnects at 40nm technology node and beyond","author":"lin","year":"2010","journal-title":"Proceedings of the AMC"},{"key":"ref1","first-page":"57","article-title":"Post Cu CMP Cleaning Process Evaluation for 32nm and 22nm Technology Nodes","author":"tseng","year":"0","journal-title":"ASMC 2012 23rd Annual SEMI"}],"event":{"name":"2015 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2015,4,19]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2015,4,23]]}},"container-title":["2015 IEEE International Reliability Physics Symposium"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7106273\/7112653\/07112775.pdf?arnumber=7112775","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T19:07:21Z","timestamp":1490382441000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7112775\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/irps.2015.7112775","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}