{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T02:49:39Z","timestamp":1725418179761},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,4]]},"DOI":"10.1109\/irps.2015.7112806","type":"proceedings-article","created":{"date-parts":[[2015,6,3]],"date-time":"2015-06-03T19:32:57Z","timestamp":1433359977000},"page":"IT.3.1-IT.3.5","source":"Crossref","is-referenced-by-count":1,"title":["Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress"],"prefix":"10.1109","author":[{"given":"D.","family":"Slottke","sequence":"first","affiliation":[]},{"given":"R.J.","family":"Kamaladasa","sequence":"additional","affiliation":[]},{"given":"M.","family":"Harmes","sequence":"additional","affiliation":[]},{"given":"I.","family":"Tsamaret","sequence":"additional","affiliation":[]},{"given":"M.","family":"Kobrinsky","sequence":"additional","affiliation":[]},{"given":"Timothy","family":"McMullen","sequence":"additional","affiliation":[]},{"given":"John","family":"Dunklee","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IRWS.2002.1194266"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IRWS.2000.911903"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"63","DOI":"10.1023\/A:1011102127642","author":"tan","year":"2001","journal-title":"Journal of Electronics Testing Theory and Applications 17"},{"journal-title":"JC-14 2–93–116","article-title":"A Guide for the Design of Straight Line SWEAT Test Structures","year":"1993","key":"ref5"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1063\/1.338378"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.1985.362083"}],"event":{"name":"2015 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2015,4,19]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2015,4,23]]}},"container-title":["2015 IEEE International Reliability Physics Symposium"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7106273\/7112653\/07112806.pdf?arnumber=7112806","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T12:55:05Z","timestamp":1498222505000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7112806\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,4]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/irps.2015.7112806","relation":{},"subject":[],"published":{"date-parts":[[2015,4]]}}}