{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T10:24:58Z","timestamp":1725704698547},"reference-count":26,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,3]]},"DOI":"10.1109\/irps.2018.8353586","type":"proceedings-article","created":{"date-parts":[[2018,5,8]],"date-time":"2018-05-08T21:16:55Z","timestamp":1525814215000},"page":"4C.4-1-4C.4-4","source":"Crossref","is-referenced-by-count":4,"title":["Impact of supply voltage and particle LET on the soft error rate of logic circuits"],"prefix":"10.1109","author":[{"given":"H.","family":"Jiang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R. C.","family":"Harrington","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J. A.","family":"Maharrey","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J. S.","family":"Kauppila","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L. W.","family":"Massengill","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B. L.","family":"Bhuva","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2015.2498927"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2014.2370057"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2005.860740"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2008.2005900"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2783239"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2015.2493886"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2012.2223827"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2718517"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/23.903824"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2005.850490"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/23.903813"},{"key":"ref3","article-title":"Next generation intel micro-architecture (Nehalem) family: Architectural insights and power management","author":"gunther","year":"2008","journal-title":"Intel Developer Forum"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6861093"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2011.2171993"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2013.2288782"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6531991"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/1108956.1108957"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2015.2495130"},{"journal-title":"Low Power Methodology Manual For System-on-Chip Design","year":"2007","author":"keating","key":"ref1"},{"journal-title":"Vanderbilt","year":"1994","author":"satagopan","key":"ref20"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2016.7574518"},{"journal-title":"Spectre Circuit Simulator Release MMSIM 12 1","year":"0","author":"cadence","key":"ref21"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/SECON.1991.147715"},{"key":"ref23","first-page":"1","article-title":"An empirical model for predicting SE cross-section for combinational logic circuits in advanced technologies","author":"jiang","year":"2017","journal-title":"IEEE Trans Nucl Sci"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1147\/rd.62.0200"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2013.2255624"}],"event":{"name":"2018 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2018,3,11]]},"location":"Burlingame, CA","end":{"date-parts":[[2018,3,15]]}},"container-title":["2018 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8345372\/8353529\/08353586.pdf?arnumber=8353586","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,6,1]],"date-time":"2018-06-01T18:55:34Z","timestamp":1527879334000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8353586\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,3]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/irps.2018.8353586","relation":{},"subject":[],"published":{"date-parts":[[2018,3]]}}}