{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:44:39Z","timestamp":1751093079907,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,3]]},"DOI":"10.1109\/irps.2018.8353658","type":"proceedings-article","created":{"date-parts":[[2018,5,8]],"date-time":"2018-05-08T17:16:55Z","timestamp":1525799815000},"page":"P-CR.5-1-P-CR.5-6","source":"Crossref","is-referenced-by-count":2,"title":["Reliability assessment of 4GSP\/s interleaved SAR ADC"],"prefix":"10.1109","author":[{"given":"R.","family":"Lajmi","sequence":"first","affiliation":[]},{"given":"F.","family":"Cacho","sequence":"additional","affiliation":[]},{"given":"O.","family":"David","sequence":"additional","affiliation":[]},{"given":"J-P.","family":"Blanc","sequence":"additional","affiliation":[]},{"given":"E.","family":"Rouat","sequence":"additional","affiliation":[]},{"given":"S.","family":"Haendler","sequence":"additional","affiliation":[]},{"given":"P.","family":"Benech","sequence":"additional","affiliation":[]},{"given":"E. Lauga","family":"Larroze","sequence":"additional","affiliation":[]},{"given":"S.","family":"Bourdel","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757479"},{"key":"ref3","article-title":"Reliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Application","volume":"9","author":"yan","year":"2009","journal-title":"IEEE Transaction on Device and Materials Reliability"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757481"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1975.1050629"},{"key":"ref2","article-title":"Studying DAC Capacitor Array Degradation in Charge Redistribution SAR ADCs","author":"aamir","year":"2014","journal-title":"Design and Diagnostics of Electronic Circuits & Systems"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IMS3TW.2015.7177870"}],"event":{"name":"2018 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2018,3,11]]},"location":"Burlingame, CA","end":{"date-parts":[[2018,3,15]]}},"container-title":["2018 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8345372\/8353529\/08353658.pdf?arnumber=8353658","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,6,1]],"date-time":"2018-06-01T14:55:35Z","timestamp":1527864935000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8353658\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,3]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/irps.2018.8353658","relation":{},"subject":[],"published":{"date-parts":[[2018,3]]}}}