{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,16]],"date-time":"2026-06-16T15:08:31Z","timestamp":1781622511430,"version":"3.54.5"},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,3]]},"DOI":"10.1109\/irps.2018.8353679","type":"proceedings-article","created":{"date-parts":[[2018,5,8]],"date-time":"2018-05-08T21:16:55Z","timestamp":1525814215000},"page":"P-MY.6-1-P-MY.6-5","source":"Crossref","is-referenced-by-count":3,"title":["Chip-level characterization and RTN-induced error mitigation beyond 20nm floating gate flash memory"],"prefix":"10.1109","author":[{"given":"T. W.","family":"Lin","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"S. H.","family":"Ku","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"C. H.","family":"Cheng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"C. W.","family":"Lee","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"family":"Ijen-Huang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wen-Jer","family":"Tsai","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"T. C.","family":"Lu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"W. P.","family":"Lu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"K. C.","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tahui","family":"Wang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chih-Yuan","family":"Lu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"crossref","DOI":"10.4324\/9781315688640","volume":"26","author":"liao","year":"2017","journal-title":"Chinese Physics B"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2016.2585860"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2012.2188531"},{"key":"ref13","first-page":"9","author":"mielke","year":"2008","journal-title":"IRPS"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2008.2003230"},{"key":"ref15","first-page":"128","author":"suh","year":"1995","journal-title":"ISSCC"},{"key":"ref16","first-page":"119","author":"mizoguchiet","year":"2017","journal-title":"IMW"},{"key":"ref17","year":"0","journal-title":"SLC NAND Secrets Exposed"},{"key":"ref18","year":"0","journal-title":"White paper CTWP010 SLC vs MLC NAND and The Impact of Technology Scaling"},{"key":"ref4","first-page":"188","author":"park","year":"2007","journal-title":"VLSI"},{"key":"ref3","first-page":"123","author":"cai","year":"2013","journal-title":"ICCD"},{"key":"ref6","first-page":"1358","author":"bucci","year":"1998","journal-title":"TIM"},{"key":"ref5","first-page":"13.1","author":"aritome","year":"2017","journal-title":"IRPS"},{"key":"ref8","first-page":"3691","author":"ishikuro","year":"1997","journal-title":"APL"},{"key":"ref7","first-page":"1162","author":"pellati","year":"2001","journal-title":"TIM"},{"key":"ref2","article-title":"NAND Flash Market Trend","year":"2016","journal-title":"Computex Taipei"},{"key":"ref1","first-page":"1","author":"aritome","year":"2016","journal-title":"IMW"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/16.108195"}],"event":{"name":"2018 IEEE International Reliability Physics Symposium (IRPS)","location":"Burlingame, CA","start":{"date-parts":[[2018,3,11]]},"end":{"date-parts":[[2018,3,15]]}},"container-title":["2018 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8345372\/8353529\/08353679.pdf?arnumber=8353679","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,17]],"date-time":"2019-10-17T19:08:28Z","timestamp":1571339308000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8353679\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,3]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/irps.2018.8353679","relation":{},"subject":[],"published":{"date-parts":[[2018,3]]}}}