{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T06:54:39Z","timestamp":1730271279918,"version":"3.28.0"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,3]]},"DOI":"10.1109\/irps.2019.8720536","type":"proceedings-article","created":{"date-parts":[[2019,5,24]],"date-time":"2019-05-24T04:11:10Z","timestamp":1558671070000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Alternating Temperature Stress and Deduction of Effective Stress Levels from Mission Profiles for Semiconductor Reliability"],"prefix":"10.1109","author":[{"given":"A.","family":"Hirler","sequence":"first","affiliation":[]},{"given":"A.","family":"Alsioufy","sequence":"additional","affiliation":[]},{"given":"J.","family":"Biba","sequence":"additional","affiliation":[]},{"given":"T.","family":"Lehndorff","sequence":"additional","affiliation":[]},{"given":"D.","family":"Lipp","sequence":"additional","affiliation":[]},{"given":"H.","family":"Lochner","sequence":"additional","affiliation":[]},{"given":"M.","family":"Siddabathula","sequence":"additional","affiliation":[]},{"given":"S.","family":"Simon","sequence":"additional","affiliation":[]},{"given":"T.","family":"Sulima","sequence":"additional","affiliation":[]},{"given":"M.","family":"Wiatr","sequence":"additional","affiliation":[]},{"given":"W.","family":"Hansch","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"276","DOI":"10.1080\/08982112.2015.1038357","article-title":"Bayesian Analysis of Step-Stress Accelerated Life Tests and Its Use in Planning","volume":"27","author":"hamada","year":"2015","journal-title":"Quality Engineering"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TR.1983.5221475"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1088\/0268-1242\/15\/5\/302"},{"key":"ref6","article-title":"Accelerated Testing","author":"nelson","year":"1990","journal-title":"ser Wiley Series in Probability and Statistics"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/S0378-4371(01)00615-X"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2007.01.030"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.007"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TR.1980.5220742"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.06.022"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/24.765928"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1080\/03610928908829990"},{"journal-title":"AEC-Q100 Rev H","article-title":"AEC-Q100 - Failure Mechanism Based Stress Test Qualification for Integrated Circuits","year":"2014","key":"ref1"}],"event":{"name":"2019 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2019,3,31]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2019,4,4]]}},"container-title":["2019 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8712125\/8720395\/08720536.pdf?arnumber=8720536","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T03:22:17Z","timestamp":1657855337000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8720536\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/irps.2019.8720536","relation":{},"subject":[],"published":{"date-parts":[[2019,3]]}}}