{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T06:54:41Z","timestamp":1730271281177,"version":"3.28.0"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,3]]},"DOI":"10.1109\/irps.2019.8720542","type":"proceedings-article","created":{"date-parts":[[2019,5,24]],"date-time":"2019-05-24T04:11:10Z","timestamp":1558671070000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["Novel Oxide Top-Off Process Enabling Reliable PC-CA TDDB on IO Devices with Self Aligned Contact"],"prefix":"10.1109","author":[{"given":"Tian","family":"Shen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Abu Naser","family":"Zainuddin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Purushothaman","family":"Srinivasan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zakariae","family":"Chbili","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kai","family":"Zhao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Patrick","family":"Justison","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6861115"},{"key":"ref3","article-title":"Oxide Reliability - A Summary of Silicon Oxide Wearout, Breakdown, and Reliability","volume":"173","author":"dumin","year":"2002","journal-title":"World Scientific Publishing"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"362","DOI":"10.1109\/16.740903","article-title":"Electrical properties of high-quality ultrathin nitride\/oxide stack dielectrics","volume":"46","author":"shi","year":"1999","journal-title":"IEEE Transactions on Electron Devices"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRev.140.A569"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2002.805612"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268476"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242496"}],"event":{"name":"2019 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2019,3,31]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2019,4,4]]}},"container-title":["2019 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8712125\/8720395\/08720542.pdf?arnumber=8720542","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T03:08:35Z","timestamp":1657854515000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8720542\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/irps.2019.8720542","relation":{},"subject":[],"published":{"date-parts":[[2019,3]]}}}