{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T12:30:36Z","timestamp":1725798636137},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,4]]},"DOI":"10.1109\/irps45951.2020.9128806","type":"proceedings-article","created":{"date-parts":[[2020,6,30]],"date-time":"2020-06-30T21:20:26Z","timestamp":1593552026000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Effects of Thermal Boundary Resistance on the Thermal Performance of GaN HEMT on Diamond"],"prefix":"10.1109","author":[{"given":"A.","family":"El Helou","sequence":"first","affiliation":[]},{"given":"M.","family":"Tadjer","sequence":"additional","affiliation":[]},{"given":"K.","family":"Hobart","sequence":"additional","affiliation":[]},{"given":"P. E.","family":"Raad","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1021\/acs.analchem.9b03238"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2018.2860792"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.92.125439"},{"article-title":"A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices: Validation","year":"2007","author":"raad","key":"ref6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201906731"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CSICS.2013.6659222"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC.2018.8593301"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1149\/08905.0011ecst"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-998-0063-x"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.03.004"}],"event":{"name":"2020 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2020,4,28]]},"location":"Dallas, TX, USA","end":{"date-parts":[[2020,5,30]]}},"container-title":["2020 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9125439\/9128217\/09128806.pdf?arnumber=9128806","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,9]],"date-time":"2022-07-09T02:21:19Z","timestamp":1657333279000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9128806\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,4]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/irps45951.2020.9128806","relation":{},"subject":[],"published":{"date-parts":[[2020,4]]}}}