{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,6]],"date-time":"2025-10-06T18:12:34Z","timestamp":1759774354985},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,3,1]],"date-time":"2021-03-01T00:00:00Z","timestamp":1614556800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,3,1]],"date-time":"2021-03-01T00:00:00Z","timestamp":1614556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,3,1]],"date-time":"2021-03-01T00:00:00Z","timestamp":1614556800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,3]]},"DOI":"10.1109\/irps46558.2021.9405132","type":"proceedings-article","created":{"date-parts":[[2021,4,26]],"date-time":"2021-04-26T22:48:05Z","timestamp":1619477285000},"page":"1-6","source":"Crossref","is-referenced-by-count":7,"title":["Reliability of Mo as Word Line Metal in 3D NAND"],"prefix":"10.1109","author":[{"given":"D.","family":"Tierno","sequence":"first","affiliation":[]},{"given":"K.","family":"Croes","sequence":"additional","affiliation":[]},{"given":"A.","family":"Ajaykumar","sequence":"additional","affiliation":[]},{"given":"S.","family":"Ramesh","sequence":"additional","affiliation":[]},{"given":"G.","family":"Van den Bosch","sequence":"additional","affiliation":[]},{"given":"M.","family":"Rosmeulen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","article-title":"Reliability of barrierless Mo interconnect","author":"tierno","year":"0","journal-title":"unpublished Submitted to 2021 IEEE International Interconnect Technology Conference"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2009.5090389"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2018.8353551"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1063\/1.4811460"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9128328"},{"year":"0","key":"ref15"},{"key":"ref16","first-page":"181","article-title":"Water and copper contamination in SiOC: H damascene: Novel characterization methodology based on triangular voltage sweep measurements","author":"ciofi","year":"0","journal-title":"2006 International Interconnect Technology Conference"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2019.8720410"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2013.2253442"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7047153"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IMW48823.2020.9108111"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2017.2709248"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2014.6831863"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2007.4339708"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.2968079"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9129246"}],"event":{"name":"2021 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2021,3,21]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2021,3,25]]}},"container-title":["2021 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9405068\/9405088\/09405132.pdf?arnumber=9405132","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,9]],"date-time":"2022-07-09T02:19:31Z","timestamp":1657333171000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9405132\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,3]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/irps46558.2021.9405132","relation":{},"subject":[],"published":{"date-parts":[[2021,3]]}}}