{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T21:14:40Z","timestamp":1725657280390},"reference-count":4,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,3]]},"DOI":"10.1109\/irps48203.2023.10117638","type":"proceedings-article","created":{"date-parts":[[2023,5,15]],"date-time":"2023-05-15T13:50:57Z","timestamp":1684158657000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Impact of Thin-oxide Gate on the On-Resistance of HV-PNP Under ESD Stress"],"prefix":"10.1109","author":[{"given":"Monishmurali","family":"M","sequence":"first","affiliation":[{"name":"Indian Institute of Science,Department of ESE,Bangalore,Karnataka,India"}]},{"given":"Nagothu Karmel","family":"Kranthi","sequence":"additional","affiliation":[{"name":"Texas Instruments Inc,Bangalore,India"}]},{"given":"Gianluca","family":"Boselli","sequence":"additional","affiliation":[{"name":"Texas Instruments Inc,Dallas,USA"}]},{"given":"Mayank","family":"Shrivastava","sequence":"additional","affiliation":[{"name":"Indian Institute of Science,Department of ESE,Bangalore,Karnataka,India"}]}],"member":"263","reference":[{"key":"ref4","first-page":"69","article-title":"Area-efficient reduced and no-snapback PNP-based ESD protection in advanced smart power technology","author":"gendron","year":"0","journal-title":"Electrical Overstress-Electrostatic Discharge Symposium 2006"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS46558.2021.9405093"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3100810"},{"key":"ref1","first-page":"1","article-title":"Mutual ballasting: A novel technique for improved inductive system level IEC ESD stress performance for automotive applications","author":"salman","year":"2013","journal-title":"Proc Electrical Overstress\/Electrostatic Discharge Symp"}],"event":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2023,3,26]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2023,3,30]]}},"container-title":["2023 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10117589\/10117581\/10117638.pdf?arnumber=10117638","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T13:50:12Z","timestamp":1686577812000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10117638\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,3]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/irps48203.2023.10117638","relation":{},"subject":[],"published":{"date-parts":[[2023,3]]}}}