{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,16]],"date-time":"2025-05-16T05:48:39Z","timestamp":1747374519254},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,3]]},"DOI":"10.1109\/irps48203.2023.10117681","type":"proceedings-article","created":{"date-parts":[[2023,5,15]],"date-time":"2023-05-15T17:50:57Z","timestamp":1684173057000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["Insight Into HCI Reliability on I\/O Nitrided Devices"],"prefix":"10.1109","author":[{"given":"C.","family":"Doyen","sequence":"first","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"V.","family":"Yon","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"X.","family":"Garros","sequence":"additional","affiliation":[{"name":"CEA-LETI,Grenoble,France"}]},{"given":"L.","family":"Basset","sequence":"additional","affiliation":[{"name":"CEA-LETI,Grenoble,France"}]},{"given":"T. Mota","family":"Frutuoso","sequence":"additional","affiliation":[{"name":"CEA-LETI,Grenoble,France"}]},{"given":"C.","family":"Dagon","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"C.","family":"Diouf","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"X.","family":"Federspiel","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"V.","family":"Millon","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"F.","family":"Monsieur","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"C.","family":"Pribat","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]},{"given":"D.","family":"Roy","sequence":"additional","affiliation":[{"name":"ST Microelectronics,Crolles,France"}]}],"member":"263","reference":[{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2004.1315299"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IIRW.2013.6804163"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/9780470455265"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6532124"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6532116"},{"journal-title":"Semiconductor Material and Device Characterization","year":"2006","author":"schroder","key":"ref6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2009.5173308"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2004.840856"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.1997.584274"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2005.1493216"}],"event":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2023,3,26]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2023,3,30]]}},"container-title":["2023 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10117589\/10117581\/10117681.pdf?arnumber=10117681","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T17:49:30Z","timestamp":1686592170000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10117681\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,3]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/irps48203.2023.10117681","relation":{},"subject":[],"published":{"date-parts":[[2023,3]]}}}