{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,19]],"date-time":"2025-09-19T11:18:14Z","timestamp":1758280694074,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,3]]},"DOI":"10.1109\/irps48203.2023.10117795","type":"proceedings-article","created":{"date-parts":[[2023,5,15]],"date-time":"2023-05-15T17:50:57Z","timestamp":1684173057000},"page":"1-4","source":"Crossref","is-referenced-by-count":5,"title":["A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects"],"prefix":"10.1109","author":[{"given":"Y.H.","family":"Lin","sequence":"first","affiliation":[{"name":"National Tsing Hua University,Department of Power Mechanical Engineering,Hsinchu,Taiwan"}]},{"given":"C.C.","family":"Lee","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Department of Power Mechanical Engineering,Hsinchu,Taiwan"}]},{"given":"C.Y.","family":"Liao","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"M.H.","family":"Lin","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"W. C.","family":"Tu","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"Robin","family":"Chen","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"H.P.","family":"Chen","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"Winston S.","family":"Shue","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]},{"given":"Min","family":"Cao","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1088\/2053-1591\/aaba4b"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897263"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2021.3132550"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3175953"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2192732"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/0022-0248(93)90280-A"},{"key":"ref1","first-page":"172","article-title":"The tension of metallic films deposited by electrolysis","volume":"82","author":"stoney","year":"1909","journal-title":"Proceedings of the Royal Society of London Series A Containing Papers of a Mathematical and Physical Character"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/ma15051683"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3115571"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-022-09819-w"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1063\/1.1521791"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1063\/1.123722"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1111\/j.1151-2916.1985.tb15316.x"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/JOSA.11.000233"}],"event":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2023,3,26]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2023,3,30]]}},"container-title":["2023 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10117589\/10117581\/10117795.pdf?arnumber=10117795","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T17:50:26Z","timestamp":1686592226000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10117795\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,3]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/irps48203.2023.10117795","relation":{},"subject":[],"published":{"date-parts":[[2023,3]]}}}