{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,19]],"date-time":"2026-03-19T00:06:47Z","timestamp":1773878807976,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,3,1]],"date-time":"2023-03-01T00:00:00Z","timestamp":1677628800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,3]]},"DOI":"10.1109\/irps48203.2023.10117810","type":"proceedings-article","created":{"date-parts":[[2023,5,15]],"date-time":"2023-05-15T17:50:57Z","timestamp":1684173057000},"page":"1-5","source":"Crossref","is-referenced-by-count":5,"title":["Reliable FeFET-based Neuromorphic Computing through Joint Modeling of Cycle-to-Cycle Variability, Device-to-Device Variability, and Domain Stochasticity"],"prefix":"10.1109","author":[{"given":"Simon","family":"Thomann","sequence":"first","affiliation":[{"name":"University of Stuttgart,Chair of Semiconductor Test and Reliability,Germany"}]},{"given":"Albi","family":"Mema","sequence":"additional","affiliation":[{"name":"University of Stuttgart,Chair of Semiconductor Test and Reliability,Germany"}]},{"given":"Kai","family":"Ni","sequence":"additional","affiliation":[{"name":"Rochester Institute of Technology,Department of Microelectronic Engineering,USA"}]},{"given":"Hussam","family":"Amrouch","sequence":"additional","affiliation":[{"name":"University of Stuttgart,Chair of Semiconductor Test and Reliability,Germany"}]}],"member":"263","reference":[{"key":"ref8","year":"0","journal-title":"Sentaurus TCAD S_2021 06"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2021.3087335"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2013.6724592"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnology18217.2020.9265014"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3203956"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720631"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ESSDERC55479.2022.9947176"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3192808"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268338"}],"event":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","location":"Monterey, CA, USA","start":{"date-parts":[[2023,3,26]]},"end":{"date-parts":[[2023,3,30]]}},"container-title":["2023 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10117589\/10117581\/10117810.pdf?arnumber=10117810","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,12]],"date-time":"2023-06-12T17:50:23Z","timestamp":1686592223000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10117810\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,3]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/irps48203.2023.10117810","relation":{},"subject":[],"published":{"date-parts":[[2023,3]]}}}