{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,17]],"date-time":"2025-05-17T04:01:58Z","timestamp":1747454518848,"version":"3.40.5"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,30]],"date-time":"2025-03-30T00:00:00Z","timestamp":1743292800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,30]],"date-time":"2025-03-30T00:00:00Z","timestamp":1743292800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,30]]},"DOI":"10.1109\/irps48204.2025.10982900","type":"proceedings-article","created":{"date-parts":[[2025,5,15]],"date-time":"2025-05-15T17:30:30Z","timestamp":1747330230000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Introduction to Voltage-Ramping Wafer Level Electromigration Method and Current Exponent Correction Factor for Co-Capping Metal Lines"],"prefix":"10.1109","author":[{"given":"Da Yong","family":"Shin","sequence":"first","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hyunjun","family":"Choi","sequence":"additional","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Joosung","family":"Kim","sequence":"additional","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Myungsoo","family":"Yeo","sequence":"additional","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Miji","family":"Lee","sequence":"additional","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Taiki","family":"Uemura","sequence":"additional","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shinyoung","family":"Chung","sequence":"additional","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jong-Ho","family":"Lee","sequence":"additional","affiliation":[{"name":"Quality and Reliability Team Samsung Electronics,Hwaseong-si,Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/TDMR.2007.902427"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/IRPS.2017.7936344"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/IRWS.2000.911906"},{"key":"ref4","article-title":"Joule Heating study in scaled Cu, Co and Ru interconnects","volume-title":"International Interconnect Technology Conference (2019) and Materials for Advanced Metallization Conference (MAM 2019)","author":"Melina","year":"2019"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/IRPS.2009.5173295"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/IRPS.2011.5784493"}],"event":{"name":"2025 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2025,3,30]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2025,4,3]]}},"container-title":["2025 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10982526\/10982704\/10982900.pdf?arnumber=10982900","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,16]],"date-time":"2025-05-16T05:40:26Z","timestamp":1747374026000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10982900\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,30]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/irps48204.2025.10982900","relation":{},"subject":[],"published":{"date-parts":[[2025,3,30]]}}}