{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,17]],"date-time":"2025-05-17T04:02:04Z","timestamp":1747454524878,"version":"3.40.5"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,30]],"date-time":"2025-03-30T00:00:00Z","timestamp":1743292800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,30]],"date-time":"2025-03-30T00:00:00Z","timestamp":1743292800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,30]]},"DOI":"10.1109\/irps48204.2025.10983099","type":"proceedings-article","created":{"date-parts":[[2025,5,15]],"date-time":"2025-05-15T17:30:30Z","timestamp":1747330230000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives"],"prefix":"10.1109","author":[{"given":"Ching-Ting","family":"Liu","sequence":"first","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yao-Chun","family":"Chuang","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jyun-Lin","family":"Wu","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jia-Shen","family":"Lan","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chang-Fu","family":"Han","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chia-Hua","family":"Chang","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jia-Ming","family":"Yang","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Sheng","family":"Lin","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chen-Wei","family":"Li","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ryan","family":"Lu","sequence":"additional","affiliation":[{"name":"Quality and Reliability Taiwan Semiconductor Manufacturing Company, Ltd.,Hsinchu,Taiwan,R.O.C."}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48203.2023.10117647"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32696.2021.00028"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2019.00095"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1557\/jmr.2004.19.1.3"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.tsf.2009.03.135"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ectc51529.2024.00391"}],"event":{"name":"2025 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2025,3,30]]},"location":"Monterey, CA, USA","end":{"date-parts":[[2025,4,3]]}},"container-title":["2025 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10982526\/10982704\/10983099.pdf?arnumber=10983099","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,16]],"date-time":"2025-05-16T05:48:08Z","timestamp":1747374488000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10983099\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,30]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/irps48204.2025.10983099","relation":{},"subject":[],"published":{"date-parts":[[2025,3,30]]}}}