{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,18]],"date-time":"2026-04-18T16:39:24Z","timestamp":1776530364291,"version":"3.51.2"},"reference-count":22,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,3,30]],"date-time":"2025-03-30T00:00:00Z","timestamp":1743292800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,3,30]],"date-time":"2025-03-30T00:00:00Z","timestamp":1743292800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,3,30]]},"DOI":"10.1109\/irps48204.2025.10983457","type":"proceedings-article","created":{"date-parts":[[2025,5,15]],"date-time":"2025-05-15T17:30:30Z","timestamp":1747330230000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Compact MEOL OxRAM with 14 Conductance Levels for Dense Embedded Inference Computing"],"prefix":"10.1109","author":[{"given":"J. Minguet","family":"Lopez","sequence":"first","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Barraud","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Dampfhoffer","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, List,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Souhait\u00e9","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T.","family":"Dubreuil","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.-M.","family":"Pedini","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Comboroure","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Gharbi","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Boulard","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Castan","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Lambert","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Andrieu","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes,CEA, Leti,Grenoble,France,F-38000"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-031-01766-7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CVPRW63382.2024.00219"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2016.7573431"},{"key":"ref4","first-page":"27.4.1","article-title":"Monolithic 3D integration of logic and memory: Carbon nanotube FETs, resistive RAM, and Silicon FETs","author":"Schulaker","journal-title":"IEDM Tech. Dig. 2014"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2012.6479146"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ESSDERC59256.2023.10268513"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnology18217.2020.9265062"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-023-41736-2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242497"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2016.7573425"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757457"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371934"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454367"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067837"},{"key":"ref15","first-page":"1","article-title":"A 14nm 128Mb Embedded MRAM Macro achieved the Best Figure-Of-Merit with 80MHz Read operation and 18. 1 Mb\/mm2 implementation at 0.6V","author":"Kang","journal-title":"VLSI Tech. Dig. 2023"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir57934.2023.10185248"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062967"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2017.7870333"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870335"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242496"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IMW51353.2021.9439607"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR52688.2022.01946"}],"event":{"name":"2025 IEEE International Reliability Physics Symposium (IRPS)","location":"Monterey, CA, USA","start":{"date-parts":[[2025,3,30]]},"end":{"date-parts":[[2025,4,3]]}},"container-title":["2025 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10982526\/10982704\/10983457.pdf?arnumber=10983457","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,16]],"date-time":"2025-05-16T05:41:31Z","timestamp":1747374091000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10983457\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,30]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/irps48204.2025.10983457","relation":{},"subject":[],"published":{"date-parts":[[2025,3,30]]}}}