{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,16]],"date-time":"2025-05-16T06:07:34Z","timestamp":1747375654885},"reference-count":35,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,3]]},"DOI":"10.1109\/irps48227.2022.9764438","type":"proceedings-article","created":{"date-parts":[[2022,5,2]],"date-time":"2022-05-02T16:44:23Z","timestamp":1651509863000},"page":"P53-1-P53-6","source":"Crossref","is-referenced-by-count":1,"title":["Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices"],"prefix":"10.1109","author":[{"given":"Taiki","family":"Uemura","sequence":"first","affiliation":[{"name":"Samsung Electronics, Co., Ltd.,Samsung Foundry,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Byungjin","family":"Chung","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Co., Ltd.,Samsung Foundry,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jegon","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Co., Ltd.,Samsung Foundry,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hyewon","family":"Shim","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Co., Ltd.,Samsung Foundry,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shinyoung","family":"Chung","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Co., Ltd.,Samsung Foundry,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Brandon","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Co., Ltd.,Samsung Foundry,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jaehee","family":"Choi","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Co., Ltd.,Semiconductor Research and Development Center,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shota","family":"Ohnishi","sequence":"additional","affiliation":[{"name":"Samsung R&#x0026;D Institute Japan,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ken","family":"Machida","sequence":"additional","affiliation":[{"name":"Samsung R&#x0026;D Institute Japan,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"year":"0","key":"ref33"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.phpro.2014.11.017"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.1979.4329940"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.phpro.2017.09.035"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/RADECS.2005.4365587"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2015.2495130"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IIRW.2010.5706480"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/REDW.2015.7336723"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2017.7936293"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9128360"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2002.1175847"},{"journal-title":"IAEA-TECDOC-1223 IAEA","article-title":"Current Status of Neutron Capture Therapy","year":"2001","key":"ref15"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1063\/1.5127704"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.nds.2012.11.002"},{"key":"ref18","first-page":"357","article-title":"Neutron interactions with matter, in Passive Non-destructive Assay of Nuclear Materials","author":"rinard","year":"1991"},{"key":"ref19","article-title":"Design of the 100-MeV Proton Beam Line for Low Flux Application","author":"kwon","year":"2016","journal-title":"Proceedings of IPAC"},{"year":"0","key":"ref28"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2015.7112677"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/19\/3\/034001"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2012.2222438"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2006.251219"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/S0969-8043(97)00038-9"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2018.2813367"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2010.5488681"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DTIS48698.2020.9080918"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2016.2535663"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2013.2287699"},{"journal-title":"JEDEC Solid State Technol Assoc","article-title":"Measurement and Reporting of Alpha Particle and Terrestrial Cosmic Ray Induced Soft Error in Semiconductor Devices: JESD89B","year":"2021","key":"ref1"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9129644"},{"journal-title":"ASTM International West Conshohocken PA","article-title":"Standard Test Method for Determining Thermal Neutron Reaction Rates and Thermal Neutron Fluence Rates by Radioactivation Techniques","year":"2017","key":"ref22"},{"key":"ref21","article-title":"Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology","author":"uemura","year":"2020","journal-title":"2020 IEEE International Reliability Physics Symposium (IRPS)"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/0141-3910(95)87013-X"},{"journal-title":"SP-8053","article-title":"Nuclear and space radiation effects on materials","year":"1970","key":"ref23"},{"year":"0","key":"ref26"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.14407\/jrpr.2017.42.1.9"}],"event":{"name":"2022 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2022,3,27]]},"location":"Dallas, TX, USA","end":{"date-parts":[[2022,3,31]]}},"container-title":["2022 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9764406\/9764408\/09764438.pdf?arnumber=9764438","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,14]],"date-time":"2022-06-14T16:41:57Z","timestamp":1655224917000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9764438\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,3]]},"references-count":35,"URL":"https:\/\/doi.org\/10.1109\/irps48227.2022.9764438","relation":{},"subject":[],"published":{"date-parts":[[2022,3]]}}}