{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,4]],"date-time":"2026-04-04T18:11:34Z","timestamp":1775326294810,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,3]]},"DOI":"10.1109\/irps48227.2022.9764514","type":"proceedings-article","created":{"date-parts":[[2022,5,2]],"date-time":"2022-05-02T16:44:23Z","timestamp":1651509863000},"page":"5C.3-1-5C.3-6","source":"Crossref","is-referenced-by-count":3,"title":["A High Voltage Tolerant Supply Clamp for ESD Protection in a 45-nm SOI Technology"],"prefix":"10.1109","author":[{"given":"Shudong","family":"Huang","sequence":"first","affiliation":[{"name":"University of Illinois at Urbana-Champaign,Department of Electrical and Computer Engineering,Urbana,IL,USA,61801"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Srivatsan","family":"Parthasarathy","sequence":"additional","affiliation":[{"name":"Analog Devices, Inc,Wilmington,MA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuanzhong Paul","family":"Zhou","sequence":"additional","affiliation":[{"name":"Analog Devices, Inc,Wilmington,MA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jean-Jacques","family":"Hajjar","sequence":"additional","affiliation":[{"name":"Analog Devices, Inc,Wilmington,MA,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Elyse","family":"Rosenbaum","sequence":"additional","affiliation":[{"name":"University of Illinois at Urbana-Champaign,Department of Electrical and Computer Engineering,Urbana,IL,USA,61801"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2006.357907"},{"key":"ref3","first-page":"eos-15","article-title":"ESD design methodology","author":"merrill","year":"1993","journal-title":"EOS\/ESD Symp Proc"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"70","DOI":"10.1109\/EOSESD.1999.818992","article-title":"Stacked PMOS clamps for high voltage power supply protection","author":"maloney","year":"1999","journal-title":"Electrical Overstress\/Electrostatic Discharge Symposium Proceedings. 1999 (IEEE Cat. No.99TH8396)"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1587\/elex.14.20170899"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2011.5937494"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"97","DOI":"10.1109\/55.2052","article-title":"Reduction of Kink Effect in Thin-Film SOI MOSFET&#x2019;s","volume":"9","author":"colinge","year":"1988","journal-title":"IEEE Electron Dev Lett"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2007.904600"},{"key":"ref9","first-page":"1","article-title":"Balancing the Trade-off Between Performance and Mis-trigger Immunity in Active Feedback-based High-voltage Tolerant Power Clamps","author":"ayling","year":"2020","journal-title":"2020 42nd Annual EOS\/ESD Symposium (EOS\/ESD)"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2015.7112794"}],"event":{"name":"2022 IEEE International Reliability Physics Symposium (IRPS)","location":"Dallas, TX, USA","start":{"date-parts":[[2022,3,27]]},"end":{"date-parts":[[2022,3,31]]}},"container-title":["2022 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9764406\/9764408\/09764514.pdf?arnumber=9764514","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,13]],"date-time":"2022-06-13T17:14:04Z","timestamp":1655140444000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9764514\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,3]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/irps48227.2022.9764514","relation":{},"subject":[],"published":{"date-parts":[[2022,3]]}}}