{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,16]],"date-time":"2025-05-16T05:48:16Z","timestamp":1747374496591,"version":"3.28.0"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,3]]},"DOI":"10.1109\/irps48227.2022.9764531","type":"proceedings-article","created":{"date-parts":[[2022,5,2]],"date-time":"2022-05-02T20:44:23Z","timestamp":1651524263000},"page":"P51-1-P51-6","source":"Crossref","is-referenced-by-count":5,"title":["Deep level effects and degradation of 0.15 \u03bcm RF AlGaN\/GaN HEMTs with Mono-layer and Bi-layer AlGaN backbarrier"],"prefix":"10.1109","author":[{"given":"Z.","family":"Gao","sequence":"first","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Chiocchetta","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"De Santi","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"N.","family":"Modolo","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F.","family":"Rampazzo","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Meneghini","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Meneghesso","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"E.","family":"Zanoni","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Blanck","sequence":"additional","affiliation":[{"name":"Universit&#x00E0; di Padova,Dipartimento di Ingegneria Dell&#x2019;Informazione,Padova,35131"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Stieglauer","sequence":"additional","affiliation":[{"name":"United Monolithic Semiconductors GmbH,Ulm,Germany,D-89081"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.","family":"Sommer","sequence":"additional","affiliation":[{"name":"United Monolithic Semiconductors GmbH,Ulm,Germany,D-89081"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L.","family":"Benoit","sequence":"additional","affiliation":[{"name":"United Monolithic Semiconductors GmbH,Ulm,Germany,D-89081"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"Grunenputt","sequence":"additional","affiliation":[{"name":"United Monolithic Semiconductors GmbH,Ulm,Germany,D-89081"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"O.","family":"Kordina","sequence":"additional","affiliation":[{"name":"United Monolithic Semiconductors GmbH,Ulm,Germany,D-89081"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jr-Tai.","family":"Chen","sequence":"additional","affiliation":[{"name":"United Monolithic Semiconductors GmbH,Ulm,Germany,D-89081"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J-C","family":"Jacquet","sequence":"additional","affiliation":[{"name":"III-V Lab,Palaiseau,France,91767"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Lacam","sequence":"additional","affiliation":[{"name":"III-V Lab,Palaiseau,France,91767"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Piotrowicz","sequence":"additional","affiliation":[{"name":"III-V Lab,Palaiseau,France,91767"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.121016"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.51.04DF04"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.1540239"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-007-0313-3"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2364855"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.35848\/1347-4065\/abdb82"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3063664"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1002\/pssa.201900762"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993632"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1063\/5.0061354"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2019.113489"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2813542"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2013.2257783"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614588"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"1022","DOI":"10.1109\/JPROC.2002.1021567","article-title":"AlGaN\/GaN HEMTs-an overview of device operation and applications","volume":"90","author":"mishra","year":"2002","journal-title":"Proceedings of the IEEE"},{"article-title":"Deep Level Defects in Electron-Irradiated Aluminum Gallium Nitride Grown by Molecular Beam Epitaxy","year":"2005","author":"hogsed","key":"ref9"}],"event":{"name":"2022 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2022,3,27]]},"location":"Dallas, TX, USA","end":{"date-parts":[[2022,3,31]]}},"container-title":["2022 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9764406\/9764408\/09764531.pdf?arnumber=9764531","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,14]],"date-time":"2022-06-14T20:41:40Z","timestamp":1655239300000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9764531\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,3]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/irps48227.2022.9764531","relation":{},"subject":[],"published":{"date-parts":[[2022,3]]}}}