{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,8]],"date-time":"2026-05-08T16:15:08Z","timestamp":1778256908130,"version":"3.51.4"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,3,1]],"date-time":"2022-03-01T00:00:00Z","timestamp":1646092800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,3]]},"DOI":"10.1109\/irps48227.2022.9764575","type":"proceedings-article","created":{"date-parts":[[2022,5,2]],"date-time":"2022-05-02T16:44:23Z","timestamp":1651509863000},"page":"5A.3-1-5A.3-4","source":"Crossref","is-referenced-by-count":7,"title":["Parasitic Drain Series Resistance Effects on Non-conducting Hot Carrier Reliability"],"prefix":"10.1109","author":[{"given":"M. J.","family":"Hauser","sequence":"first","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]},{"given":"P.","family":"Srinivasan","sequence":"additional","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]},{"given":"A.","family":"Vallett","sequence":"additional","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]},{"given":"R.","family":"Krishnasamy","sequence":"additional","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]},{"given":"F.","family":"Guarin","sequence":"additional","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]},{"given":"D.","family":"Brochu","sequence":"additional","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]},{"given":"V.","family":"Pham","sequence":"additional","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]},{"given":"B.","family":"Min","sequence":"additional","affiliation":[{"name":"Globalfoundries US Inc,Technology Reliability and Developement,Malta,NY,USA,12020"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/0038-1101(61)90054-5"},{"key":"ref3","article-title":"Parasitic S\/D Resistance Effects on Hot-Carrier Reliability in Body-Tied FinFETs","volume":"27","author":"han","year":"2006","journal-title":"IEEE Electron Device Letters"},{"key":"ref6","article-title":"Hot-Carrier-Induced Damage and its Spatial Location on RF Noise in Deep-Submicrometer NMOSFETs","author":"su","year":"2008","journal-title":"IEEE Transactions on Microwave Theory and Techniques"},{"key":"ref5","article-title":"Figures of Merit for CMOS Low-Noise Amplifiers and Estimates for their Theoretical Limits","author":"belostotski","year":"2021","journal-title":"ECCTD"},{"key":"ref8","author":"kao","year":"2010"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/55.924845"},{"key":"ref2","article-title":"Device Reliability Tutorial","author":"rauch","year":"2007","journal-title":"Unpublished Research IBM"},{"key":"ref1","article-title":"Structure-Dependent MOSFET Degradation due to Hot-Electron Injection","author":"hsu","year":"1983","journal-title":"IEDM"}],"event":{"name":"2022 IEEE International Reliability Physics Symposium (IRPS)","location":"Dallas, TX, USA","start":{"date-parts":[[2022,3,27]]},"end":{"date-parts":[[2022,3,31]]}},"container-title":["2022 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9764406\/9764408\/09764575.pdf?arnumber=9764575","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,14]],"date-time":"2022-06-14T16:42:11Z","timestamp":1655224931000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9764575\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,3]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/irps48227.2022.9764575","relation":{},"subject":[],"published":{"date-parts":[[2022,3]]}}}