{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,6]],"date-time":"2024-10-06T01:17:56Z","timestamp":1728177476097},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,14]]},"DOI":"10.1109\/irps48228.2024.10529312","type":"proceedings-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:48Z","timestamp":1715880108000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["Laboratory X-Ray-Assisted Device Alteration for Fault Isolation and Post-Silicon Debug"],"prefix":"10.1109","author":[{"given":"K. C.","family":"Celio","sequence":"first","affiliation":[{"name":"Intel Corp.,Intel Foundry Quality and Reliability Lab Network,Hillsboro,OR,USA"}]},{"given":"S.","family":"Sen","sequence":"additional","affiliation":[{"name":"Intel Corp.,Manufacturing and Product Engineering Physical Debug,Hillsboro,OR,USA"}]},{"given":"E.","family":"Nisenboim","sequence":"additional","affiliation":[{"name":"Manufacturing and Product Engineering Physical Debug, Intel Corp.,Haifa,Israel"}]},{"given":"P. M.","family":"Pardy","sequence":"additional","affiliation":[{"name":"Intel Corp.,Manufacturing and Product Engineering Physical Debug,Hillsboro,OR,USA"}]},{"given":"B.","family":"Nguyen","sequence":"additional","affiliation":[{"name":"Intel Corp.,Manufacturing and Product Engineering Product Failure Analysis,Santa Clara,CA,USA"}]},{"given":"V.","family":"Le","sequence":"additional","affiliation":[{"name":"Intel Corp.,Manufacturing and Product Engineering Product Failure Analysis,Santa Clara,CA,USA"}]},{"given":"W.","family":"Nolting","sequence":"additional","affiliation":[{"name":"Intel Corp.,Intel Foundry Quality and Reliability Lab Network,Hillsboro,OR,USA"}]},{"given":"S.","family":"Kumar","sequence":"additional","affiliation":[{"name":"Intel Corp.,Intel Foundry Quality and Reliability Lab Network,Hillsboro,OR,USA"}]},{"given":"C. A.","family":"Peterson","sequence":"additional","affiliation":[{"name":"Intel Corp.,Intel Foundry Quality and Reliability Lab Network,Hillsboro,OR,USA"}]},{"given":"A.","family":"Raveh","sequence":"additional","affiliation":[{"name":"Intel Corp.,Intel Foundry Quality and Reliability Lab Network,Hillsboro,OR,USA"}]},{"given":"K.","family":"Johnson","sequence":"additional","affiliation":[{"name":"Intel Corp.,Intel Foundry Quality and Reliability Lab Network,Hillsboro,OR,USA"}]},{"given":"B.","family":"Stripe","sequence":"additional","affiliation":[{"name":"Sigray Inc.,Concord,CA,USA"}]},{"given":"F.","family":"Su","sequence":"additional","affiliation":[{"name":"Sigray Inc.,Concord,CA,USA"}]},{"given":"M.","family":"Lun","sequence":"additional","affiliation":[{"name":"Sigray Inc.,Concord,CA,USA"}]},{"given":"S.","family":"Lewis","sequence":"additional","affiliation":[{"name":"Sigray Inc.,Concord,CA,USA"}]},{"given":"R. I.","family":"Spink","sequence":"additional","affiliation":[{"name":"Sigray Inc.,Concord,CA,USA"}]},{"given":"W.","family":"Yun","sequence":"additional","affiliation":[{"name":"Sigray Inc.,Concord,CA,USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MSPEC.2022.9976473"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir57934.2023.10185208"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32696.2021.00166"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2020.2971861"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/nphys1457"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2003.1270848"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.31399\/asm.cp.istfa2022p0153"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2786140"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2016.2634538"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2020.2979905"},{"volume-title":"X-Ray Interactions with Matter","year":"2024","key":"ref11"}],"event":{"name":"2024 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2024,4,14]]},"location":"Grapevine, TX, USA","end":{"date-parts":[[2024,4,18]]}},"container-title":["2024 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10529283\/10529298\/10529312.pdf?arnumber=10529312","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,17]],"date-time":"2024-05-17T05:11:17Z","timestamp":1715922677000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529312\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,14]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/irps48228.2024.10529312","relation":{},"subject":[],"published":{"date-parts":[[2024,4,14]]}}}