{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T06:58:01Z","timestamp":1730271481368,"version":"3.28.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,14]]},"DOI":"10.1109\/irps48228.2024.10529368","type":"proceedings-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:48Z","timestamp":1715880108000},"page":"10A.4-1-10A.4-6","source":"Crossref","is-referenced-by-count":1,"title":["A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses"],"prefix":"10.1109","author":[{"given":"J.","family":"Shuster-Passage","sequence":"first","affiliation":[{"name":"GlobalFoundries,Malta,NY,USA,12020"}]},{"given":"S. Abdel","family":"Razek","sequence":"additional","affiliation":[{"name":"GlobalFoundries,Malta,NY,USA,12020"}]},{"given":"M.","family":"Mattoo","sequence":"additional","affiliation":[{"name":"GlobalFoundries,Malta,NY,USA,12020"}]},{"given":"M.","family":"Hauschildt","sequence":"additional","affiliation":[{"name":"GlobalFoundries,Malta,NY,USA,12020"}]},{"given":"S.","family":"Choi","sequence":"additional","affiliation":[{"name":"GlobalFoundries,Malta,NY,USA,12020"}]},{"given":"M.","family":"Gall","sequence":"additional","affiliation":[{"name":"GlobalFoundries,Malta,NY,USA,12020"}]},{"given":"A.","family":"Kteyan","sequence":"additional","affiliation":[{"name":"Siemens EDA,Yerevan,Armenia,0036"}]},{"given":"J.-H.","family":"Choy","sequence":"additional","affiliation":[{"name":"Siemens EDA,Fremont,CA,USA,94538"}]},{"given":"V.","family":"Sukharev","sequence":"additional","affiliation":[{"name":"Siemens EDA,Fremont,CA,USA,94538"}]},{"given":"M.","family":"Kraatz","sequence":"additional","affiliation":[{"name":"Fraunhofer IKTS,Dresden,Germany,01109"}]},{"given":"J. R.","family":"Lloyd","sequence":"additional","affiliation":[{"name":"GlobalFoundries,Malta,NY,USA,12020"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"crossref","first-page":"1203","DOI":"10.1063\/1.322842","volume":"47","author":"Blech","year":"1976","journal-title":"J. Appl. Phys."},{"key":"ref2","first-page":"5E.1","volume-title":"Proc. IEEE IRPS","author":"Christiansen","year":"2012"},{"key":"ref3","first-page":"6B.3","volume-title":"Proc. IEEE IRPS","author":"Lee","year":"2012"},{"key":"ref4","first-page":"4F.2","volume-title":"Proc. IEEE IRPS","author":"Kraatz","year":"2018"},{"key":"ref5","first-page":"1","volume-title":"Proc. IEEE IRPS","author":"Zhang","year":"2021"},{"key":"ref6","first-page":"27","volume-title":"Proc. IEEE IITC","author":"Witvrouw","year":"1998"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"3790","DOI":"10.1063\/1.354073","volume":"73","author":"Korhonen","year":"1993","journal-title":"J. Appl. Phys."},{"key":"ref8","doi-asserted-by":"crossref","first-page":"50","DOI":"10.1109\/TDMR.2015.2508447","volume":"16","author":"Sukharev","year":"2016","journal-title":"IEEE Transactions on Device and Materials Reliability"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"1317","DOI":"10.1109\/TCAD.2017.2666723","volume":"37","author":"Chatterjee","year":"2018","journal-title":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"},{"key":"ref10","volume":"39","author":"Torosyan","year":"2020","journal-title":"Journal of Vacuum Science & Technology B"},{"key":"ref11","doi-asserted-by":"crossref","DOI":"10.1557\/JMR.2000.0259","volume":"15","author":"Hau-Riege","year":"2000","journal-title":"J. Mater. Res."},{"key":"ref12","first-page":"265","article-title":"Reliability of Interconnect Structures","volume-title":"Volume 8: Interfacial and Nanoscale Failure. Comprehensive Structural Integrity","author":"Suo","year":"2003"},{"key":"ref13","doi-asserted-by":"crossref","first-page":"229","DOI":"10.1146\/annurev.matsci.30.1.229","volume":"30","author":"Rosenberg","year":"2000","journal-title":"Annu. Rev. Mater. Sci."}],"event":{"name":"2024 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2024,4,14]]},"location":"Grapevine, TX, USA","end":{"date-parts":[[2024,4,18]]}},"container-title":["2024 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10529283\/10529298\/10529368.pdf?arnumber=10529368","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,17]],"date-time":"2024-05-17T05:11:44Z","timestamp":1715922704000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529368\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,14]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/irps48228.2024.10529368","relation":{},"subject":[],"published":{"date-parts":[[2024,4,14]]}}}