{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T14:28:55Z","timestamp":1773844135504,"version":"3.50.1"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100002427","name":"Ford Motor Company","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100002427","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,14]]},"DOI":"10.1109\/irps48228.2024.10529373","type":"proceedings-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:48Z","timestamp":1715880108000},"page":"1-6","source":"Crossref","is-referenced-by-count":8,"title":["Evaluation of Burn-in Technique on Gate Oxide Reliability in Commercial SiC MOSFETs"],"prefix":"10.1109","author":[{"given":"Limeng","family":"Shi","sequence":"first","affiliation":[{"name":"The Ohio State University,Dept. of Electrical & Computer Engineering,Columbus,Ohio,USA"}]},{"given":"Jiashu","family":"Qian","sequence":"additional","affiliation":[{"name":"The Ohio State University,Dept. of Electrical & Computer Engineering,Columbus,Ohio,USA"}]},{"given":"Michael","family":"Jin","sequence":"additional","affiliation":[{"name":"The Ohio State University,Dept. of Electrical & Computer Engineering,Columbus,Ohio,USA"}]},{"given":"Monikuntala","family":"Bhattacharya","sequence":"additional","affiliation":[{"name":"The Ohio State University,Dept. of Electrical & Computer Engineering,Columbus,Ohio,USA"}]},{"given":"Hengyu","family":"Yu","sequence":"additional","affiliation":[{"name":"The Ohio State University,Dept. of Electrical & Computer Engineering,Columbus,Ohio,USA"}]},{"given":"Marvin H.","family":"White","sequence":"additional","affiliation":[{"name":"The Ohio State University,Dept. of Electrical & Computer Engineering,Columbus,Ohio,USA"}]},{"given":"Anant K.","family":"Agarwal","sequence":"additional","affiliation":[{"name":"The Ohio State University,Dept. of Electrical & Computer Engineering,Columbus,Ohio,USA"}]},{"given":"Atsushi","family":"Shimbori","sequence":"additional","affiliation":[{"name":"Ford Motor Company,Dearborn,Michigan,USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/wipda58524.2023.10382228"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/irps48203.2023.10117998"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.mssp.2024.108194"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.3390\/en14248283"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/irps45951.2020.9128223"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2009.07.016"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/wipda58524.2023.10382194"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/irps48203.2023.10118276"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2014.2356172"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/iedm13553.2020.9371992"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/wipda56483.2022.9955295"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/irps48203.2023.10117802"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/access.2021.3124706"}],"event":{"name":"2024 IEEE International Reliability Physics Symposium (IRPS)","location":"Grapevine, TX, USA","start":{"date-parts":[[2024,4,14]]},"end":{"date-parts":[[2024,4,18]]}},"container-title":["2024 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10529283\/10529298\/10529373.pdf?arnumber=10529373","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,17]],"date-time":"2024-05-17T05:12:25Z","timestamp":1715922745000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529373\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,14]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/irps48228.2024.10529373","relation":{},"subject":[],"published":{"date-parts":[[2024,4,14]]}}}