{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,28]],"date-time":"2025-08-28T12:42:28Z","timestamp":1756384948274},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["T2293704,T2293700,62027818,62125401,61927901"],"award-info":[{"award-number":["T2293704,T2293700,62027818,62125401,61927901"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,14]]},"DOI":"10.1109\/irps48228.2024.10529425","type":"proceedings-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:48Z","timestamp":1715880108000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["A Thermal Profile Prediction Methodology for Nanosheet Circuits Featuring Cross-Layer Thermal Coupling Effect"],"prefix":"10.1109","author":[{"given":"Shuying","family":"Wang","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,China"}]},{"given":"Yewei","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,China"}]},{"given":"Yunjoong","family":"Kim","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro\/Nano Electronics,China"}]},{"given":"Pengpeng","family":"Ren","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,China"}]},{"given":"Zhigang","family":"Ji","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,China"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/ted.2022.3140283"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1016\/j.memori.2023.100056"},{"key":"ref3","article-title":"Challenges and Opportunities for Stacked Transistor: DTCO and Device","author":"Wang","year":"2021","journal-title":"2021 VLSI"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/tnano.2019.2909951"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/ted.2019.2942074"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/led.2008.2000966"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/16.477781"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1063\/1.1567461"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/ted.2022.3140283"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/iedm.2018.8614576"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/icee56203.2022.10117683"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/ted.2023.3268249"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/ted.2021.3095038"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/s3s.2018.8640137"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1016\/j.sse.2022.108546"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/ted.2018.2825498"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/tdmr.2022.3181672"},{"doi-asserted-by":"publisher","key":"ref18","DOI":"10.1117\/12.2615311"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/iccad.2001.968613"},{"doi-asserted-by":"publisher","key":"ref20","DOI":"10.23919\/vlsit.2017.7998183"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1109\/relphy.2005.1493053"}],"event":{"name":"2024 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2024,4,14]]},"location":"Grapevine, TX, USA","end":{"date-parts":[[2024,4,18]]}},"container-title":["2024 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10529283\/10529298\/10529425.pdf?arnumber=10529425","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,17]],"date-time":"2024-05-17T05:12:39Z","timestamp":1715922759000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529425\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,14]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/irps48228.2024.10529425","relation":{},"subject":[],"published":{"date-parts":[[2024,4,14]]}}}