{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,7]],"date-time":"2025-08-07T09:20:55Z","timestamp":1754558455023,"version":"3.37.3"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["T2293700,T2293704,62027818,61927901"],"award-info":[{"award-number":["T2293700,T2293704,62027818,61927901"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research & Development Program of China","doi-asserted-by":"publisher","award":["2019YFB2205005"],"award-info":[{"award-number":["2019YFB2205005"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,14]]},"DOI":"10.1109\/irps48228.2024.10529452","type":"proceedings-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:48Z","timestamp":1715880108000},"page":"P75.TX-1-P75.TX-4","source":"Crossref","is-referenced-by-count":2,"title":["A New Method of Automatic Extraction of RTN and OMI-Friendly Implementation"],"prefix":"10.1109","author":[{"given":"Yu","family":"Xiao","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong university, Shanghai, China and Peking University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,Beijing,China"}]},{"given":"Chenyang","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong university, Shanghai, China and Peking University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,Beijing,China"}]},{"given":"Da","family":"Wang","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong university, Shanghai, China and Peking University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,Beijing,China"}]},{"given":"Yongkang","family":"Xue","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong university, Shanghai, China and Peking University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,Beijing,China"}]},{"given":"Pengpeng","family":"Ren","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong university, Shanghai, China and Peking University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,Beijing,China"}]},{"given":"Zhigang","family":"Ji","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong university, Shanghai, China and Peking University,National Key Laboratory of Science and Technology on Micro\/Nano Fabrication,Beijing,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242499"},{"key":"ref2","first-page":"112","volume-title":"Bias temperature instability for devices and circuits","author":"Tibor","year":"2013"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1587\/transele.e95.c.414"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2368191"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.1150519"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424230"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7047169"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2012.6479071"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/EDSSC.2013.6628059"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2013.6724731"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2017.7936288"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1080\/00018738900101122"},{"key":"ref13","first-page":"24","article-title":"Review and comparison of variable step-size LMS algorithms","volume":"21.1","author":"Dariusz","year":"2016","journal-title":"International Journal of Acoustics and Vibration"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2010.5703435"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON47005.2019.8983538"}],"event":{"name":"2024 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2024,4,14]]},"location":"Grapevine, TX, USA","end":{"date-parts":[[2024,4,18]]}},"container-title":["2024 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10529283\/10529298\/10529452.pdf?arnumber=10529452","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,26]],"date-time":"2024-09-26T17:39:55Z","timestamp":1727372395000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529452\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,14]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/irps48228.2024.10529452","relation":{},"subject":[],"published":{"date-parts":[[2024,4,14]]}}}