{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,27]],"date-time":"2026-01-27T23:42:02Z","timestamp":1769557322879,"version":"3.49.0"},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004731","name":"Zhejiang Provincial Natural Science Foundation","doi-asserted-by":"publisher","award":["LDQ24F040001,LZ23F040001"],"award-info":[{"award-number":["LDQ24F040001,LZ23F040001"]}],"id":[{"id":"10.13039\/501100004731","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62025402,62374151"],"award-info":[{"award-number":["62025402,62374151"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","award":["226-2023-00004"],"award-info":[{"award-number":["226-2023-00004"]}],"id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,14]]},"DOI":"10.1109\/irps48228.2024.10529455","type":"proceedings-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:48Z","timestamp":1715880108000},"page":"P70.TX-1-P70.TX-4","source":"Crossref","is-referenced-by-count":2,"title":["Low Temperature Characterization and Modeling of Hot Carrier Injection in 14 nm Si FinFET"],"prefix":"10.1109","author":[{"given":"Junru","family":"Qu","sequence":"first","affiliation":[{"name":"School of Micro-Nano Electronics, Zhejiang University,Hangzhou,China,310000"}]},{"given":"Dong","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Micro-Nano Electronics, Zhejiang University,Hangzhou,China,310000"}]},{"given":"Bing","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University,Xi'an,China,710071"}]},{"given":"Ying","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Micro-Nano Electronics, Zhejiang University,Hangzhou,China,310000"}]},{"given":"Xinze","family":"Li","sequence":"additional","affiliation":[{"name":"School of Micro-Nano Electronics, Zhejiang University,Hangzhou,China,310000"}]},{"given":"Chengji","family":"Jin","sequence":"additional","affiliation":[{"name":"Research Center for Intelligent Chips and Devices,Zhejiang Lab,Hangzhou,China,311121"}]},{"given":"Jiajia","family":"Chen","sequence":"additional","affiliation":[{"name":"Research Center for Intelligent Chips and Devices,Zhejiang Lab,Hangzhou,China,311121"}]},{"given":"Haoji","family":"Qian","sequence":"additional","affiliation":[{"name":"Research Center for Intelligent Chips and Devices,Zhejiang Lab,Hangzhou,China,311121"}]},{"given":"Rongzong","family":"Shen","sequence":"additional","affiliation":[{"name":"Research Center for Intelligent Chips and Devices,Zhejiang Lab,Hangzhou,China,311121"}]},{"given":"Xiao","family":"Yu","sequence":"additional","affiliation":[{"name":"Research Center for Intelligent Chips and Devices,Zhejiang Lab,Hangzhou,China,311121"}]},{"given":"Dawei","family":"Gao","sequence":"additional","affiliation":[{"name":"Zhejiang ICsprout Semiconductor,Hangzhou,China,311200"}]},{"given":"Ran","family":"Cheng","sequence":"additional","affiliation":[{"name":"School of Micro-Nano Electronics, Zhejiang University,Hangzhou,China,310000"}]},{"given":"Genquan","family":"Han","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University,Xi'an,China,710071"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/iedm19573.2019.8993666"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.23919\/mixdes.2019.8787164"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063109"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2017.2737549"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/irps.2009.5173397"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/irps45951.2020.9128316"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/irps45951.2020.9129312"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tdmr.2021.3124417"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/edtm.2018.8421469"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2017.8268344"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1116\/1.3534021"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/led.2015.2503920"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/irps48227.2022.9764515"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/irps48227.2022.9764470"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/jeds.2020.2981401"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1063\/1.2161191"},{"key":"ref17","first-page":"53","volume-title":"Low Temperature Electronics: Physics, Devices, Circuits, and Applications","author":"Gutierrez-D","year":"2000"}],"event":{"name":"2024 IEEE International Reliability Physics Symposium (IRPS)","location":"Grapevine, TX, USA","start":{"date-parts":[[2024,4,14]]},"end":{"date-parts":[[2024,4,18]]}},"container-title":["2024 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10529283\/10529298\/10529455.pdf?arnumber=10529455","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,17]],"date-time":"2024-05-17T04:56:29Z","timestamp":1715921789000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529455\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,14]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/irps48228.2024.10529455","relation":{},"subject":[],"published":{"date-parts":[[2024,4,14]]}}}