{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,3]],"date-time":"2025-08-03T04:22:17Z","timestamp":1754194937854},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,14]],"date-time":"2024-04-14T00:00:00Z","timestamp":1713052800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,4,14]]},"DOI":"10.1109\/irps48228.2024.10529472","type":"proceedings-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T17:21:48Z","timestamp":1715880108000},"page":"8B.4-1-8B.4-8","source":"Crossref","is-referenced-by-count":3,"title":["Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies"],"prefix":"10.1109","author":[{"given":"Nitish","family":"Kumar","sequence":"first","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"Venkateswarlu","family":"Sankatali","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"Yukai","family":"Chen","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"Moritz","family":"Brunion","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"Subrat","family":"Mishra","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"Ankur","family":"Gupta","sequence":"additional","affiliation":[{"name":"Centre for Applied Research in Electronics, Indian Institute of Technology Delhi,New Delhi,India,110016"}]},{"given":"Pushpapraj","family":"Singh","sequence":"additional","affiliation":[{"name":"Centre for Applied Research in Electronics, Indian Institute of Technology Delhi,New Delhi,India,110016"}]},{"given":"Francky","family":"Catthoor","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"James","family":"Myers","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"Julien","family":"Ryckaert","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]},{"given":"Dwaipayan","family":"Biswas","sequence":"additional","affiliation":[{"name":"IMEC,Leuven,Belgium,3001"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/43.62751"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067271"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019349"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3297078"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48203.2023.10117701"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3207553"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ITherm45881.2020.9190392"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9129287"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC57263.2022.9950683"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48203.2023.10117979"},{"volume-title":"Sentaurus Device User Guide","year":"2023","key":"ref11"},{"volume-title":"Ampere\u00ae Altra\u00ae 64-Bit Multi-Core Processor [Online]","key":"ref12"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731588"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062889"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48227.2022.9764572"},{"key":"ref16","first-page":"1","article-title":"Solder-TIMs (Thermal Interface Materials) for superior thermal management in power electronics","volume-title":"18th European Microelectronics & Packaging Conference","author":"Vijay"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993631"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3208848"}],"event":{"name":"2024 IEEE International Reliability Physics Symposium (IRPS)","start":{"date-parts":[[2024,4,14]]},"location":"Grapevine, TX, USA","end":{"date-parts":[[2024,4,18]]}},"container-title":["2024 IEEE International Reliability Physics Symposium (IRPS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10529283\/10529298\/10529472.pdf?arnumber=10529472","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,17]],"date-time":"2024-05-17T05:13:32Z","timestamp":1715922812000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10529472\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4,14]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/irps48228.2024.10529472","relation":{},"subject":[],"published":{"date-parts":[[2024,4,14]]}}}