{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,31]],"date-time":"2025-12-31T06:55:15Z","timestamp":1767164115021,"version":"build-2238731810"},"reference-count":38,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/isca.2006.39","type":"proceedings-article","created":{"date-parts":[[2006,7,21]],"date-time":"2006-07-21T19:17:51Z","timestamp":1153509471000},"page":"78-88","source":"Crossref","is-referenced-by-count":222,"title":["Techniques for Multicore Thermal Management: Classification and New Exploration"],"prefix":"10.1109","author":[{"given":"J.","family":"Donald","sequence":"first","affiliation":[]},{"given":"M.","family":"Martonosi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","article-title":"Power efficiency of multiple clock multiple voltage cores","author":"iyer","year":"2002","journal-title":"Proc Conf Computer-Aided Design"},{"key":"35","article-title":"Dynamic thermal management for distributed systems","author":"weissel","year":"2004","journal-title":"Proc 1st Workshop Temperature-Aware Computer Systems"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1145\/871506.871561"},{"key":"36","doi-asserted-by":"crossref","DOI":"10.1145\/1024393.1024423","article-title":"Formal online methods for voltage\/frequency control in multiple clock domain microprocessors","author":"wu","year":"2004","journal-title":"Proc Int l Conf Architectural Support for Programming Languages and Operating Systems"},{"key":"18","first-page":"878","article-title":"Compact thermal modeling for temperature-aware design","author":"wei huang","year":"2004","journal-title":"Proceedings 41st Design Automation Conference 2004 DAC"},{"key":"33","doi-asserted-by":"crossref","DOI":"10.1145\/871656.859620","article-title":"Temperature-aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proc Intl Symp Computer Architecture"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2005.16"},{"key":"34","article-title":"A feedback-driven proportion allocator for real-rate scheduling","author":"steere","year":"1999","journal-title":"Proc Symp Operating Systems Design and Implementation"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/2.869367"},{"key":"13","article-title":"Managing the impact of increasing microprocessor power consumption","volume":"q1","author":"gunther","year":"2001","journal-title":"Intel Technology Journal"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1166\/jolpe.2007.128"},{"key":"37","article-title":"A dynamic compilation framework for controlling microprocessor energy and performance","author":"wu","year":"2005","journal-title":"Proc Int Symp High Performance Comput Architecture"},{"key":"11","article-title":"Design choices for thermal control in dual-core processors","author":"ghiasi","year":"2004","journal-title":"Proc Workshop Complexity Effective Design"},{"key":"38","article-title":"Voltage and frequency control with adaptive reaction time in multiple-clock-domain processors","author":"wu","year":"2005","journal-title":"Proc 11th Int l Symp High-Performance Computer Architecture"},{"key":"12","article-title":"Research challenges on temperature-aware computer systems","author":"gonza?lez","year":"2005","journal-title":"Proc Second Workshop on Temperature-Aware Computer Systems"},{"key":"21","article-title":"Power-performance implications of thread-level parallelism on chip multiprocessors","author":"li","year":"2005","journal-title":"P=AC2 IBM Conf on Architectures Compilers and Circuits"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1145\/502217.502254"},{"key":"22","doi-asserted-by":"publisher","DOI":"10.1109\/LPE.2004.1349305"},{"key":"23","article-title":"Performance, energy, and thermal considerations for SMT and CMP architectures","author":"li","year":"2005","journal-title":"Proc 11th Int l Symp High-Performance Computer Architecture"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2003.1240945"},{"key":"25","article-title":"X86 power and thermal management","author":"mcgregor","year":"2004","journal-title":"Microprocessor Report"},{"key":"26","article-title":"Event-driven thermal management in SMP systems","author":"merkel","year":"2005","journal-title":"Proc Workshop Temperature-Aware Comput Syst"},{"key":"27","doi-asserted-by":"publisher","DOI":"10.1109\/40.768496"},{"key":"28","article-title":"Smart chip, system and data center: Dynamic provisioning of power and cooling from chip core to the cooling tower","author":"patel","year":"2005","journal-title":"Proc Second Workshop on Temperature-Aware Computer Systems"},{"key":"29","article-title":"Heat-and-run: Leveraging SMT and CMP to manage power density through the operating system","author":"powell","year":"2004","journal-title":"Proc Int l Conf Architectural Support for Programming Languages and Operating Systems"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/40.782564"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2005.51"},{"key":"10","article-title":"Leveraging simultaneous multithreading for adaptive thermal control","author":"donald","year":"2005","journal-title":"Proc Workshop Temperature-Aware Comput Syst"},{"key":"1","year":"2005","journal-title":"ACPI - Advanced Configuration and Power Interface"},{"key":"30","doi-asserted-by":"crossref","DOI":"10.1109\/MICRO.2004.35","article-title":"Thermal modeling, characterization and management of on-chip networks","author":"shang","year":"2004","journal-title":"Proc of the 37th Intl Symp on Microarchitecture"},{"key":"7","article-title":"Thermal-effective clustered microarchitectures","author":"chaparro","year":"2004","journal-title":"Proc 1st Workshop Temperature-Aware Computer Systems"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2005.12"},{"key":"32","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2002.995695"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2001.903261"},{"key":"31","doi-asserted-by":"publisher","DOI":"10.1145\/605397.605403"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/40.888701"},{"key":"9","article-title":"Temperature-aware design issues for SMT and CMP architectures","author":"donald","year":"2004","journal-title":"Proc Workshop Complexity Effective Design"},{"key":"8","article-title":"Design and implementation of the POWERS? microprocessor","author":"clabes","year":"2004","journal-title":"Proc of the 8004 Intl Solid-State Circuits Conf"}],"updated-by":[{"DOI":"10.1145\/1150019.1136493","type":"new_edition","label":"New edition","source":"publisher","updated":{"date-parts":[[2006,5,1]],"date-time":"2006-05-01T00:00:00Z","timestamp":1146441600000}}],"event":{"name":"33rd International Symposium on Computer Architecture (ISCA'06)","location":"Boston, MA, USA"},"container-title":["33rd International Symposium on Computer Architecture (ISCA'06)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/10899\/34298\/01635942.pdf?arnumber=1635942","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,7,30]],"date-time":"2021-07-30T00:30:34Z","timestamp":1627605034000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1635942\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":38,"URL":"https:\/\/doi.org\/10.1109\/isca.2006.39","relation":{},"subject":[]}}