{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,24]],"date-time":"2025-03-24T06:39:33Z","timestamp":1742798373446,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/iscas.2002.1009926","type":"proceedings-article","created":{"date-parts":[[2003,6,25]],"date-time":"2003-06-25T16:42:54Z","timestamp":1056559374000},"page":"I-657-I-660","source":"Crossref","is-referenced-by-count":5,"title":["A MEMS socket system for high density SoC interconnection"],"prefix":"10.1109","volume":"1","author":[{"given":"S.","family":"Chowdhury","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Ahmadi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.A.","family":"Jullien","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W.C.","family":"Miller","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"1147","article-title":"Development of a Wafer-level Bum-In Test Socket for Fine-Pitch BGA","author":"qiao","year":"2000","journal-title":"Electronics Components and Technology Conference"},{"key":"ref3","article-title":"Some Scenarios on Wafer-Level Test & Bum-In","author":"million","year":"0","journal-title":"2001 IEEE Bum-in and Test Sockets Workshop"},{"key":"ref6","first-page":"509","author":"budynas","year":"1999","journal-title":"Advanced Strength and Applied Stress Analysis"},{"key":"ref5","first-page":"165","article-title":"Gold to Gold Thermosonic Flip-Chip Bonding","author":"cheah","year":"2001","journal-title":"Proc 2001 HD Int Conf High-Density Interconnect Syst Packag"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1179\/136217101101538631"},{"key":"ref7","first-page":"79","author":"timoshenko","year":"1959","journal-title":"Theory of Plates and Shells"},{"key":"ref2","first-page":"37","article-title":"Socket Update: Smooth Sailing Ahead for Test and Burn-in Sockets","volume":"4","author":"iscoff","year":"2000","journal-title":"Chip Scale Review"},{"key":"ref1","first-page":"60","article-title":"Semiconductor Industry Association","year":"1999","journal-title":"International technology roadmap for semiconductors 1999 edition"}],"event":{"name":"2002 IEEE International Symposium on Circuits and Systems","acronym":"ISCAS-02","location":"Phoenix-Scottsdale, AZ, USA"},"container-title":["2002 IEEE International Symposium on Circuits and Systems. Proceedings (Cat. No.02CH37353)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/7897\/21766\/01009926.pdf?arnumber=1009926","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,10]],"date-time":"2017-03-10T13:48:32Z","timestamp":1489153712000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1009926\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/iscas.2002.1009926","relation":{},"subject":[]}}