{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,8,6]],"date-time":"2024-08-06T05:49:16Z","timestamp":1722923356706},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/iscas.2003.1206179","type":"proceedings-article","created":{"date-parts":[[2003,11,4]],"date-time":"2003-11-04T18:56:54Z","timestamp":1067972214000},"page":"IV-652-IV-655","source":"Crossref","is-referenced-by-count":13,"title":["Mixed-mode ESD protection circuit simulation-design methodology"],"prefix":"10.1109","volume":"4","author":[{"given":"H.","family":"Feng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.","family":"Zhan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Q.","family":"Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"X.","family":"Guan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Xie","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.Z.","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2000.852624"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(98)00117-6"},{"journal-title":"MIL-STD-883C 3015 7","article-title":"Military Standard for Test Methods and Procedures for Microelectronics: ESD Sensitivity Classification","year":"1989","key":"ref6"},{"year":"0","key":"ref5","article-title":"TSUPREM4 2D Semiconductor Process Simulation User's Manual"},{"year":"0","key":"ref8","article-title":"MEDICI 2D Semiconductor Device Simulation User's Manual"},{"article-title":"Modeling of Electrical Overstress in Integrated Circuits","year":"1994","author":"diaz","key":"ref7"},{"key":"ref2","first-page":"7","article-title":"A review of EOS\/ESD field failures in military equipment","author":"green","year":"1988","journal-title":"Proc EOS\/ESD Symposium"},{"key":"ref1","first-page":"233","article-title":"ESD design methodology","author":"merri","year":"1993","journal-title":"Proc EOS\/ESD Symposium"}],"event":{"name":"ISCAS 2003. International Symposium on Circuits and Systems","acronym":"ISCAS-03","location":"Bangkok, Thailand"},"container-title":["Proceedings of the 2003 International Symposium on Circuits and Systems, 2003. ISCAS '03."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8570\/27140\/01206179.pdf?arnumber=1206179","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T12:54:57Z","timestamp":1489409697000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1206179\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/iscas.2003.1206179","relation":{},"subject":[]}}