{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T09:49:57Z","timestamp":1725616197076},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/iscas.2006.1693544","type":"proceedings-article","created":{"date-parts":[[2006,9,22]],"date-time":"2006-09-22T17:01:13Z","timestamp":1158944473000},"page":"4155-4158","source":"Crossref","is-referenced-by-count":10,"title":["A Novel, Coupling Driven, Low Power Bus Coding Technique for Minimizing Capacitive Crosstalk in VLSI Interconnects"],"prefix":"10.1109","author":[{"given":"K.S.","family":"Sainarayanan","sequence":"first","affiliation":[]},{"given":"J.V.R.","family":"Ravindra","sequence":"additional","affiliation":[]},{"given":"M.B.","family":"Srinivas","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"year":"0","key":"3"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/92.365453"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2001.968598"},{"year":"0","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1145\/280756.280876"},{"key":"6","first-page":"318","article-title":"Coupling Driven Signal Encoding Scheme for Low Power Interface Design","author":"kim","year":"2000","journal-title":"ICCAD 2000 San Jose CA"},{"key":"5","article-title":"Shift Invert Coding (SHINV) for low power VLSI","author":"natesan","year":"0","journal-title":"Proc of the Digital System Design EUROMICRO Systems"},{"article-title":"Interconnect Modeling and Optimization in Deep Submicron Technologies","year":"2002","author":"sotiriadis","key":"4"},{"key":"9","doi-asserted-by":"crossref","first-page":"441","DOI":"10.1109\/DATE.2000.840308","article-title":"A Bus Delay Reduction Technique Considering Crosstalk","author":"hirose","year":"2000","journal-title":"Proc Design Automation Test Eur Conf Exhibition 2000"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1145\/224081.224114"},{"journal-title":"Circuits Interconnections and Packaging for VLSI","year":"1990","author":"bakoglu","key":"11"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-2325-3"}],"event":{"name":"2006 IEEE International Symposium on Circuits and Systems","acronym":"ISCAS-06","location":"Island of Kos, Greece"},"container-title":["2006 IEEE International Symposium on Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/11145\/35661\/01693544.pdf?arnumber=1693544","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,17]],"date-time":"2017-06-17T09:30:46Z","timestamp":1497691846000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1693544\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/iscas.2006.1693544","relation":{},"subject":[]}}