{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T15:49:20Z","timestamp":1725724160722},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2008,5,1]],"date-time":"2008-05-01T00:00:00Z","timestamp":1209600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2008,5,1]],"date-time":"2008-05-01T00:00:00Z","timestamp":1209600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,5]]},"DOI":"10.1109\/iscas.2008.4542030","type":"proceedings-article","created":{"date-parts":[[2008,6,16]],"date-time":"2008-06-16T16:26:17Z","timestamp":1213633577000},"page":"2765-2768","source":"Crossref","is-referenced-by-count":1,"title":["3-D thermal simulation with dynamic power profiles"],"prefix":"10.1109","author":[{"family":"Eunjoo Choi","sequence":"first","affiliation":[{"name":"Dept. of Electrical Engineering, KAIST Daejeon 305-701, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Youngsoo Shin","sequence":"additional","affiliation":[{"name":"Dept. of Electrical Engineering, KAIST Daejeon 305-701, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/TCAD.2002.804385"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1109\/43.712099"},{"doi-asserted-by":"publisher","key":"10","DOI":"10.1007\/BF01386093"},{"doi-asserted-by":"publisher","key":"1","DOI":"10.1109\/4.668981"},{"year":"1997","journal-title":"Heat Transfer","key":"7"},{"year":"1996","journal-title":"Fundamentals of Heat and Mass Transfer","key":"6"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1145\/944645.944687"},{"year":"2005","journal-title":"Leakage in Nanometer CMOS Technologies","key":"4"},{"doi-asserted-by":"publisher","key":"9","DOI":"10.1137\/0103003"},{"year":"1994","journal-title":"Finite Difference Methods in Heat Transfer","key":"8"},{"year":"2000","journal-title":"Electrothermal Analysis of VLSI Systems","key":"11"},{"doi-asserted-by":"publisher","key":"12","DOI":"10.1166\/jolpe.2007.128"}],"event":{"name":"2008 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2008,5,18]]},"location":"Seattle, WA, USA","end":{"date-parts":[[2008,5,21]]}},"container-title":["2008 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4534149\/4541329\/04542030.pdf?arnumber=4542030","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,16]],"date-time":"2024-02-16T01:25:01Z","timestamp":1708046701000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/4542030\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,5]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/iscas.2008.4542030","relation":{},"subject":[],"published":{"date-parts":[[2008,5]]}}}