{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T15:50:23Z","timestamp":1725724223448},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2008,5,1]],"date-time":"2008-05-01T00:00:00Z","timestamp":1209600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2008,5,1]],"date-time":"2008-05-01T00:00:00Z","timestamp":1209600000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,5]]},"DOI":"10.1109\/iscas.2008.4542168","type":"proceedings-article","created":{"date-parts":[[2008,6,16]],"date-time":"2008-06-16T16:26:17Z","timestamp":1213633577000},"page":"3318-3321","source":"Crossref","is-referenced-by-count":0,"title":["A low-power monolithically stacked 3D-TCAM"],"prefix":"10.1109","author":[{"family":"Mingjie Lin","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, Stanford University, CA 94305, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Jianying Luo","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Stanford University, CA 94305, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yaling Ma","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, Clemson University, SC 29631, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","first-page":"465","article-title":"advanced ternary cam circuits on 0.13um logic process technology","author":"roth","year":"2004","journal-title":"Proc IEEE Custom Integrated Circuits Conf (CICC)"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.831433"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.864128"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2006.346730"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2003.812496"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.887920"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.1997.621492"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/5.920580"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.837244"}],"event":{"name":"2008 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2008,5,18]]},"location":"Seattle, WA, USA","end":{"date-parts":[[2008,5,21]]}},"container-title":["2008 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4534149\/4541329\/04542168.pdf?arnumber=4542168","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,16]],"date-time":"2024-02-16T01:24:53Z","timestamp":1708046693000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/4542168\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,5]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/iscas.2008.4542168","relation":{},"subject":[],"published":{"date-parts":[[2008,5]]}}}