{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T02:06:57Z","timestamp":1729649217575,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,5]]},"DOI":"10.1109\/iscas.2011.5937691","type":"proceedings-article","created":{"date-parts":[[2011,7,7]],"date-time":"2011-07-07T13:30:57Z","timestamp":1310045457000},"page":"817-820","source":"Crossref","is-referenced-by-count":3,"title":["Bonding-wire triangular spiral inductor for on-chip switching power converters"],"prefix":"10.1109","author":[{"given":"Gerard","family":"Villar","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Julia","family":"Delos","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eduard","family":"Alarcon","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/4.982419"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/63.602562"},{"journal-title":"Monolithic integration in standard CMOS technologies of switching power converters for low power applications","year":"2007","author":"villar pique","key":"ref12"},{"key":"ref13","first-page":"268","article-title":"A fully-integrated 0.18um cmos dc-dc step-up converter, using a bondwire spiral inductor","author":"wens","year":"2007","journal-title":"Proc of European Solid-State Circuit Conference ESSCIRC-04"},{"journal-title":"Inductance Calculations","year":"2004","author":"grover","key":"ref14"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/PESC.2005.1581831"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2005.846537"},{"key":"ref6","first-page":"81","article-title":"Inductance calculations for MCM system design and simulation","author":"klemmer","year":"1995","journal-title":"Multi-Chip Module Conference 1995 MCMC-95 Proceedings 1995 IEEE"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2005.846527"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.1995.535550"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"63","DOI":"10.1109\/22.363006","article-title":"Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits","volume":"43","author":"lee","year":"1995","journal-title":"IEEE Transactions on Microwave Theory and Techniques"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/63.774209"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/41.735330"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/22.981292"}],"event":{"name":"2011 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2011,5,15]]},"location":"Rio de Janeiro, Brazil","end":{"date-parts":[[2011,5,18]]}},"container-title":["2011 IEEE International Symposium of Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5910713\/5937406\/05937691.pdf?arnumber=5937691","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T22:57:06Z","timestamp":1497913026000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5937691\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,5]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iscas.2011.5937691","relation":{},"subject":[],"published":{"date-parts":[[2011,5]]}}}