{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T15:32:54Z","timestamp":1729611174493,"version":"3.28.0"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,5]]},"DOI":"10.1109\/iscas.2011.5937972","type":"proceedings-article","created":{"date-parts":[[2011,7,7]],"date-time":"2011-07-07T13:30:57Z","timestamp":1310045457000},"page":"1952-1955","source":"Crossref","is-referenced-by-count":1,"title":["A thermal-aware task mapping flow for coarse-grain dynamic reconfigurable processor"],"prefix":"10.1109","author":[{"given":"Li","family":"Xie","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weifeng","family":"He","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naifeng","family":"Jing","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhigang","family":"Mao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"The Stanford SUIF Compiler Group","year":"0","key":"ref4"},{"key":"ref3","first-page":"864","article-title":"XPP-VC: AC Compiler with Temporal Partitioning for the PACT-XPP Architecture","author":"joao","year":"0","journal-title":"Proceedings of the Reconfigurable Computing Is Going Mainstream 12th International Conference on Field-Programmable Logic and Applications"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879797"},{"key":"ref5","doi-asserted-by":"crossref","first-page":"1127","DOI":"10.1109\/TVLSI.2008.2000726","article-title":"Static and dynamic temperature-aware scheduling for multiprocessor SoCs","volume":"16","author":"ayse","year":"2008","journal-title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems"},{"key":"ref8","first-page":"1","article-title":"A Thermal Management and Profiling Method for Reconfigurable Hardware Applications","author":"phillip","year":"0","journal-title":"Field Programmable Logic and Applications International Conference On"},{"journal-title":"Thermal modeling and management of microprocessors","year":"2009","author":"sankaranarayanan","key":"ref7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/12.859540"},{"key":"ref9","article-title":"HotSpot: Thermal modeling for CMOS VLSI systems","author":"huang","year":"2005","journal-title":"IEEE Transactions on Component Packaging and Manufacturing Technology"},{"key":"ref1","first-page":"269","article-title":"Reconfigurable computing architecture survey and introduction","author":"ali","year":"0","journal-title":"International Conference on Information Science and Technology"}],"event":{"name":"2011 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2011,5,15]]},"location":"Rio de Janeiro, Brazil","end":{"date-parts":[[2011,5,18]]}},"container-title":["2011 IEEE International Symposium of Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5910713\/5937406\/05937972.pdf?arnumber=5937972","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T22:57:03Z","timestamp":1497913023000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5937972\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,5]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/iscas.2011.5937972","relation":{},"subject":[],"published":{"date-parts":[[2011,5]]}}}