{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T12:01:43Z","timestamp":1763726503932,"version":"3.28.0"},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,5]]},"DOI":"10.1109\/iscas.2011.5938067","type":"proceedings-article","created":{"date-parts":[[2011,7,7]],"date-time":"2011-07-07T13:30:57Z","timestamp":1310045457000},"page":"2321-2324","source":"Crossref","is-referenced-by-count":20,"title":["Compact lumped element model for TSV in 3D-ICs"],"prefix":"10.1109","author":[{"given":"Khaled","family":"Salah","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alaa","family":"El Rouby","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hani","family":"Ragai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Karim","family":"Amin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yehea","family":"Ismail","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306542"},{"key":"ref11","article-title":"Compact AC Modeling and Analysis of Cu, W, and CNT based Through-Silicon Vias (TSVs) in 3-D ICs","author":"xu","year":"2009","journal-title":"IEDM09–521"},{"key":"ref12","article-title":"Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs","volume":"57","author":"stucchi","year":"2010","journal-title":"IEEE Transactions on Electron Devices"},{"year":"0","key":"ref13"},{"year":"0","key":"ref14"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1002\/0470068329"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/61.296251"},{"journal-title":"Applied Dimensional Analysis and Modeling","year":"1997","author":"szirtes","key":"ref17"},{"year":"0","key":"ref18"},{"key":"ref4","article-title":"High RF Performance TSV Silicon Carrier for High Frequency Application","author":"ho","year":"2008","journal-title":"Electronic Components and Technology Conference"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373897"},{"key":"ref6","article-title":"Through-silicon via based 3D IC technology: Electrostatic simulations for design methodology","author":"rousseau","year":"2008","journal-title":"IMAPS Device Packaging Conference"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2009.5338488"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2026200"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2008.4541535"},{"key":"ref2","first-page":"351","article-title":"Electrical Characterization of Through Silicon Via (TSV) depending on Structural and Material Parameters based on 3D Full Wave Simulation","author":"pak","year":"2008","journal-title":"Electromagnetic Electronic Materials and Packaging 2007 Conf"},{"key":"ref1","first-page":"151","article-title":"High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package","author":"ryu","year":"2005","journal-title":"Proc 14th Topical Meeting on Electrical Performance of Electronic Packaging"},{"key":"ref9","article-title":"Closed-form Equations for Through-Silicon Via (TSV) Parasitics in 3-D Integrated Circuits (ICs)","author":"weerasekera","year":"2009","journal-title":"Proc Workshop 3-D Integr DATE Conf"}],"event":{"name":"2011 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2011,5,15]]},"location":"Rio de Janeiro, Brazil","end":{"date-parts":[[2011,5,18]]}},"container-title":["2011 IEEE International Symposium of Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5910713\/5937406\/05938067.pdf?arnumber=5938067","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T03:33:35Z","timestamp":1490067215000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5938067\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,5]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/iscas.2011.5938067","relation":{},"subject":[],"published":{"date-parts":[[2011,5]]}}}