{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:36:33Z","timestamp":1781886993845,"version":"3.54.5"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,5]]},"DOI":"10.1109\/iscas.2016.7527389","type":"proceedings-article","created":{"date-parts":[[2016,11,1]],"date-time":"2016-11-01T20:59:26Z","timestamp":1478033966000},"page":"910-913","source":"Crossref","is-referenced-by-count":10,"title":["Identifying systematic spatial failure patterns through wafer clustering"],"prefix":"10.1109","author":[{"given":"Mohamed Baker","family":"Alawieh","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fa","family":"Wang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xin","family":"Li","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2013.6651901"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488821"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105321"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2245942"},{"key":"ref14","author":"orshansky","year":"2007","journal-title":"Design for Manufacturability and Statistical Design A Constructive Approach"},{"key":"ref15","author":"jain","year":"1988","journal-title":"Algorithms for clustering data"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICTAI.2004.50"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/0146-664X(73)90029-4"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654349"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2164536"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2015.2405252"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687481"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSM.2006.4493000"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2011.5763138"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2012.6233045"},{"key":"ref1","year":"2013","journal-title":"International Technology Roadmap for Semiconductors"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1117\/12.600198"}],"event":{"name":"2016 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Montr\u00e9al, QC, Canada","start":{"date-parts":[[2016,5,22]]},"end":{"date-parts":[[2016,5,25]]}},"container-title":["2016 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7515073\/7527154\/07527389.pdf?arnumber=7527389","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,10,14]],"date-time":"2020-10-14T16:15:04Z","timestamp":1602692104000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7527389"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,5]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/iscas.2016.7527389","relation":{},"subject":[],"published":{"date-parts":[[2016,5]]}}}