{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T22:23:17Z","timestamp":1725661397767},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018]]},"DOI":"10.1109\/iscas.2018.8351002","type":"proceedings-article","created":{"date-parts":[[2018,5,4]],"date-time":"2018-05-04T18:00:05Z","timestamp":1525456805000},"page":"1-4","source":"Crossref","is-referenced-by-count":7,"title":["Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration"],"prefix":"10.1109","author":[{"given":"Masahide","family":"Goto","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuki","family":"Honda","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toshihisa","family":"Watabe","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kei","family":"Hagiwara","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Masakazu","family":"Nanba","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yoshinori","family":"Iguchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takuya","family":"Saraya","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Masaharu","family":"Kobayashi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eiji","family":"Higurashi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroshi","family":"Toshiyoshi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toshiro","family":"Hiramoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/16.877174"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1049\/el:20040055"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2679058"},{"key":"ref13","first-page":"125","article-title":"Hybrid bonding characteristics of Au\/SiO2 substrates for 3D integrated image sensors","author":"hagiwara","year":"2013","journal-title":"Conference on Wafer Bonding for Microsystems and Wafer Level Integration"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046980"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2425393"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2015.7333539"},{"key":"ref17","doi-asserted-by":"crossref","first-page":"324","DOI":"10.1109\/IEDM.1982.190285","article-title":"no image lag photodiode structure in the interline ccd image sensor","author":"teranishi","year":"1982","journal-title":"1982 International Electron Devices Meeting"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1997.650533"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2014.6894429"},{"key":"ref3","first-page":"484","article-title":"A 1\/4-inch 8 Mpixel back-illuminated stacked CMOS image sensor","author":"sukegawa","year":"0"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2012.2215871"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2011.5937874"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.1994.344657"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2030550"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1201\/CRCOPTSCIENG"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/16.628824"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/4.808907"}],"event":{"name":"2018 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2018,5,27]]},"location":"Florence","end":{"date-parts":[[2018,5,30]]}},"container-title":["2018 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8334884\/8350884\/08351002.pdf?arnumber=8351002","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,21]],"date-time":"2019-10-21T20:51:48Z","timestamp":1571691108000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8351002\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/iscas.2018.8351002","relation":{},"subject":[],"published":{"date-parts":[[2018]]}}}