{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,8,10]],"date-time":"2024-08-10T06:31:23Z","timestamp":1723271483051},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,5]]},"DOI":"10.1109\/iscas.2018.8351132","type":"proceedings-article","created":{"date-parts":[[2018,5,4]],"date-time":"2018-05-04T22:00:05Z","timestamp":1525471205000},"source":"Crossref","is-referenced-by-count":3,"title":["A 20MHz Low Dropout Controlled Current Sensor for Constant On-Time Based Envelop Tacking Supply Modulator for Radio Frequency Power Amplifier"],"prefix":"10.1109","author":[{"given":"Wei-Ting","family":"Lin","sequence":"first","affiliation":[]},{"given":"Zong-Yi","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Chia-Hao","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Ke-Horng","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Ying-Hsi","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Jian-Ru","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Tsung-Yen","family":"Tsai","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487772"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487771"},{"key":"ref6","first-page":"2030","article-title":"High-Efficiency Silicon-Based Envelope-Tracking Power Amplifier Design With Envelope Shaping for Broadband Wireless Applications","author":"wu","year":"2013","journal-title":"IEEE Journal of Solid-State Circuits"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2184639"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2200109"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.897170"},{"key":"ref2","first-page":"2030","article-title":"High-Efficiency Silicon-Based Envelope-Tracking Power Amplifier Design With Envelope Shaping for Broadband Wireless Applications","author":"wu","year":"2013","journal-title":"IEEE Journal of Solid-State Circuits"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2015.7387489"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2201289"}],"event":{"name":"2018 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Florence","start":{"date-parts":[[2018,5,27]]},"end":{"date-parts":[[2018,5,30]]}},"container-title":["2018 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8334884\/8350884\/08351132.pdf?arnumber=8351132","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,22]],"date-time":"2019-10-22T00:52:56Z","timestamp":1571705576000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8351132\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,5]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/iscas.2018.8351132","relation":{},"subject":[],"published":{"date-parts":[[2018,5]]}}}