{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,27]],"date-time":"2025-11-27T06:37:13Z","timestamp":1764225433582},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018]]},"DOI":"10.1109\/iscas.2018.8351893","type":"proceedings-article","created":{"date-parts":[[2018,5,4]],"date-time":"2018-05-04T18:00:05Z","timestamp":1525456805000},"page":"1-5","source":"Crossref","is-referenced-by-count":6,"title":["Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes"],"prefix":"10.1109","author":[{"given":"Martino","family":"Dazzi","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pierpaolo","family":"Palestri","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Davide","family":"Rossi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andrea","family":"Bandiziol","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Igor","family":"Loi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David","family":"Bellasi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luca","family":"Benini","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-014-0433-7"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7062928"},{"journal-title":"UMC 65nm technology","year":"0","key":"ref12"},{"journal-title":"Channel Compliance Testing Utilizing Novel Statistical Eye Methodology","year":"2004","author":"sanders","key":"ref13"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2009.2021069"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2017.8050284"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/22.348090"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.1980.1124303"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1977.1129179"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1973.1127911"},{"journal-title":"Sensory TrulyNatural Technology DataSheet","year":"0","key":"ref4"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/CVPRW.2014.95"},{"journal-title":"MR10Q010&#x2013;1Mb Quad Output High-Speed Serial SPI MRAM","year":"0","author":"technologies","key":"ref6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.ymeth.2017.06.019"},{"journal-title":"mipi M-PHY","year":"0","author":"alliance","key":"ref8"},{"journal-title":"HyperRAM Memory","year":"0","key":"ref7"},{"journal-title":"STM32F4 series of high-performance MCUs with DSP and FPU instructions","year":"0","author":"microelectronics","key":"ref2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2015.2477016"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2017.3711645"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1049\/el:19820186"},{"journal-title":"Microwave Engineering Using Microstrip Circuits","year":"1990","author":"fooks","key":"ref22"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1980.1130112"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2628049"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2241799"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2645738"}],"event":{"name":"2018 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2018,5,27]]},"location":"Florence","end":{"date-parts":[[2018,5,30]]}},"container-title":["2018 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8334884\/8350884\/08351893.pdf?arnumber=8351893","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,21]],"date-time":"2019-10-21T20:51:08Z","timestamp":1571691068000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8351893\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/iscas.2018.8351893","relation":{},"subject":[],"published":{"date-parts":[[2018]]}}}