{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,9]],"date-time":"2026-04-09T14:38:39Z","timestamp":1775745519099,"version":"3.50.1"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,10,1]],"date-time":"2020-10-01T00:00:00Z","timestamp":1601510400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,10,1]],"date-time":"2020-10-01T00:00:00Z","timestamp":1601510400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,10]]},"DOI":"10.1109\/iscas45731.2020.9180435","type":"proceedings-article","created":{"date-parts":[[2020,9,29]],"date-time":"2020-09-29T13:22:27Z","timestamp":1601385747000},"page":"1-4","source":"Crossref","is-referenced-by-count":13,"title":["A Low-Power 65\/14nm Stacked CMOS Image Sensor"],"prefix":"10.1109","author":[{"given":"Minho","family":"Kwon","sequence":"first","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Seunghyun","family":"Lim","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Hyeokjong","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Il-Seon","family":"Ha","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Moo-Young","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Il-Jin","family":"Seo","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Suho","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Yongsuk","family":"Choi","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Kyunghoon","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Hansoo","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Won-Woong","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Seonghye","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Kyongmin","family":"Koh","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Jesuk","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"given":"Yongin","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614594"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1149\/1.3615171"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8351578"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7417934"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993567"},{"key":"ref8","first-page":"126","article-title":"A 1.1?m 33Mpixel 240fps 3D-Stacked CMOS Image Sensor with 3-Stage Cyclic-Based Analog-to-Digital Converters","author":"arai","year":"2016","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7062950"},{"key":"ref2","first-page":"104t","article-title":"An all pixel PDAF CMOS image sensor with 0.64?mx1.28?m photodiode separated by self-aligned in-pixel deep trench isolation for high AF performance","author":"choi","year":"2017","journal-title":"IEEE Symp VLSI Circuits"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662388"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870268"}],"event":{"name":"2020 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Seville, Spain","start":{"date-parts":[[2020,10,12]]},"end":{"date-parts":[[2020,10,14]]}},"container-title":["2020 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9179985\/9180369\/09180435.pdf?arnumber=9180435","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,15]],"date-time":"2024-01-15T21:04:20Z","timestamp":1705352660000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9180435\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/iscas45731.2020.9180435","relation":{},"subject":[],"published":{"date-parts":[[2020,10]]}}}